iPhone 7: Will It Have Intel Inside?
Eric Zeman, InformationWeek
October 19, 2015
Apple already relies on Intel to provide the processors for its Mac computers, and may ask the chipmaker to supply a key component for the next-generation iPhone, the so-called iPhone 7. Intel has as many as one thousand engineers working to integrate its 7360 LTE modem with Apple's application processor.
The deal would be a major win for Intel.
To read the full article, click here
Related Semiconductor IP
- USB 4.0 V2 PHY - 4TX/2RX, TSMC N3P , North/South Poly Orientation
- FH-OFDM Modem
- NFC wireless interface supporting ISO14443 A and B with EEPROM on SMIC 180nm
- PQC CRYSTALS core for accelerating NIST FIPS 202 FIPS 203 and FIPS 204
- UCIe Controller baseline for Streaming Protocols for ASIL B Compliant, AEC-Q100 Grade 2
Related News
- iPhone 7 Sports Intel, TSMC
- iPhone 7 Materials Costs Higher than Previous Versions, IHS Markit Teardown Reveals
- Intel signs 7 out of top 10 fabless companies, sees 18A test chip
- Intel Launches Agilex 7 FPGAs with R-Tile, First FPGA with PCIe 5.0 and CXL Capabilities
Latest News
- Codasip Faces Sale – Pivotal Moment for EU RISC-V Sovereignty
- Synopsys Issues Statement in Connection to the Lifting of Recent U.S. Export Restrictions Related to China
- Consumer-Tech Brand, Nothing, Taps Ceva’s RealSpace Software to Bring Immersive Spatial Audio to Headphones and Earbuds
- Tenstorrent Acquires Blue Cheetah Analog Design
- Quintauris and WITTENSTEIN high integrity systems Partner to Advance Safety-Critical RISC-V Solutions for Automotive Applications