iPhone 7: Will It Have Intel Inside?
Eric Zeman, InformationWeek
October 19, 2015
Apple already relies on Intel to provide the processors for its Mac computers, and may ask the chipmaker to supply a key component for the next-generation iPhone, the so-called iPhone 7. Intel has as many as one thousand engineers working to integrate its 7360 LTE modem with Apple's application processor.
The deal would be a major win for Intel.
To read the full article, click here
Related Semiconductor IP
- 1.8V/3.3V I/O library with ODIO and 5V HPD in TSMC 16nm
- 1.8V/3.3V I/O Library with ODIO and 5V HPD in TSMC 12nm
- 1.8V to 5V GPIO, 1.8V to 5V Analog in TSMC 180nm BCD
- 1.8V/3.3V GPIO Library with HDMI, Aanlog & LVDS Cells in TSMC 22nm
- Specialed 20V Analog I/O in TSMC 55nm
Related News
- What Apple Stuffed Inside iPhone 6 Plus
- iPhone 7 Sports Intel, TSMC
- iPhone 7 Materials Costs Higher than Previous Versions, IHS Markit Teardown Reveals
- Intel signs 7 out of top 10 fabless companies, sees 18A test chip
Latest News
- Will RISC-V reduce auto MCU’s future risk?
- Frontgrade Gaisler Launches New GRAIN Line and Wins SNSA Contract to Commercialize First Energy-Efficient Neuromorphic AI for Space Applications
- Continuous-Variable Quantum Key Distribution (CV-QKD) system demonstration
- Latest intoPIX JPEG XS Codec Powers FOR-A’s FA-1616 for Efficient IP Production at NAB 2025
- VeriSilicon Launches ISP9000: The Next-Generation AI-Embedded ISP for Intelligent Vision Applications