iPhone 7: Will It Have Intel Inside?
Eric Zeman, InformationWeek
October 19, 2015
Apple already relies on Intel to provide the processors for its Mac computers, and may ask the chipmaker to supply a key component for the next-generation iPhone, the so-called iPhone 7. Intel has as many as one thousand engineers working to integrate its 7360 LTE modem with Apple's application processor.
The deal would be a major win for Intel.
To read the full article, click here
Related Semiconductor IP
- USB 20Gbps Device Controller
- Fault Tolerant DDR2/DDR3/DDR4 Memory controller
- 25MHz to 4.0GHz Fractional-N RC PLL Synthesizer on TSMC 3nm N3P
- AGILEX 7 R-Tile Gen5 NVMe Host IP
- 100G PAM4 Serdes PHY - 14nm
Related News
- iPhone 7 Sports Intel, TSMC
- iPhone 7 Materials Costs Higher than Previous Versions, IHS Markit Teardown Reveals
- Intel Launches Agilex 7 FPGAs with R-Tile, First FPGA with PCIe 5.0 and CXL Capabilities
- ARM revenues rise 7% sequentially on higher royalties from chip makers
Latest News
- Qualitas Semiconductor Successfully Demonstrates Live UCIe PHY IP at AI Infra Summit 2025
- Silicon Creations Announces 1000th Production FinFET Tapeout at TSMC and Immediate Availability of Full IP Library on TSMC N2 Technology
- Intel and NVIDIA to Jointly Develop AI Infrastructure and Personal Computing Products
- Comcores MACsec IP is compliant with the OPEN Alliance Standard
- Sofics joins GlobalFoundries’ GlobalSolutions Ecosystem to Enhance Chip Robustness, Performance and Design Efficiency