India preps $5 billion two-fab plan
Peter Clarke, EETimes
4/21/2011 6:03 AM EDT
LONDON – The Indian government has announced renewed efforts to try and create a chip manufacturing industry on the sub-continent and is looking for investment of about $5 billion to build two wafer fabs.
The exact level of government support for the plan would be finalized by way of negotiations with interested parties. This is set to happen after a report has been produced by the newly-formed Empowered Committee for identifying technology and investors for Semiconductor Wafer Fabrication (Fab) Manufacturing Facilities, the Indian government said in a statement.
The Empowered Committee is composed mainly of political appointments but is expected to co-opt industry experts and is due to report back to government by July 31, 2011.
To read the full article, click here
Related Semiconductor IP
- SLVS Transceiver in TSMC 28nm
- 0.9V/2.5V I/O Library in TSMC 55nm
- 1.8V/3.3V Multi-Voltage GPIO in TSMC 28nm
- 1.8V/3.3V I/O Library with 5V ODIO & Analog in TSMC 16nm
- ESD Solutions for Multi-Gigabit SerDes in TSMC 28nm
Related News
- Semiconductor Manufacturing Monitor Points to Moderating Industry Contraction in Q2 2023, SEMI Reports
- U.S. Government Awards GlobalFoundries New $3.1 Billion, 10-Year Contract for Secure Chip Manufacturing
- Global Semiconductor Manufacturing Industry Set for Q4 2023 Recovery, SEMI Reports
- GlobalFoundries and Biden-Harris Administration Announce CHIPS and Science Act Funding for Essential Chip Manufacturing
Latest News
- Will RISC-V reduce auto MCU’s future risk?
- Frontgrade Gaisler Launches New GRAIN Line and Wins SNSA Contract to Commercialize First Energy-Efficient Neuromorphic AI for Space Applications
- Continuous-Variable Quantum Key Distribution (CV-QKD) system demonstration
- Latest intoPIX JPEG XS Codec Powers FOR-A’s FA-1616 for Efficient IP Production at NAB 2025
- VeriSilicon Launches ISP9000: The Next-Generation AI-Embedded ISP for Intelligent Vision Applications