India preps $5 billion two-fab plan
Peter Clarke, EETimes
4/21/2011 6:03 AM EDT
LONDON – The Indian government has announced renewed efforts to try and create a chip manufacturing industry on the sub-continent and is looking for investment of about $5 billion to build two wafer fabs.
The exact level of government support for the plan would be finalized by way of negotiations with interested parties. This is set to happen after a report has been produced by the newly-formed Empowered Committee for identifying technology and investors for Semiconductor Wafer Fabrication (Fab) Manufacturing Facilities, the Indian government said in a statement.
The Empowered Committee is composed mainly of political appointments but is expected to co-opt industry experts and is due to report back to government by July 31, 2011.
To read the full article, click here
Related Semiconductor IP
- HBM4 PHY IP
- Ultra-Low-Power LPDDR3/LPDDR2/DDR3L Combo Subsystem
- MIPI D-PHY and FPD-Link (LVDS) Combinational Transmitter for TSMC 22nm ULP
- VIP for Compute Express Link (CXL)
- HBM4 Controller IP
Related News
- SmartSoC Solutions Partners with Cortus to Advance Chip Design and Manufacturing for SIM Cards, Smart Cards, Banking Cards, and E-Passports in India
- Semiconductor Manufacturing Monitor Points to Moderating Industry Contraction in Q2 2023, SEMI Reports
- Global Semiconductor Manufacturing Industry Set for Q4 2023 Recovery, SEMI Reports
- Global Semiconductor Manufacturing Industry Strengthens in Q2 2024, SEMI Reports
Latest News
- TSMC to Lead Rivals at 2-nm Node, Analysts Say
- Energy-efficient RF power modules developed using SOI technology
- Quintauris Demonstrates RISC-V Innovation in Automotive at CES
- UMC Reports Sales for December 2025
- Tenstorrent unveiled its first-generation compact AI accelerator device designed in partnership with Razer™ today at CES 2026