How the CHIPS Act Will Impact Engineers
By C.D. McGrady, EETimes (October 21, 2022)
The $52 billion spending plan outlined in the CHIPS and Science Act that has been signed into law has significant implications for the semiconductor ecosystem—from chip manufacturers to engineers and production teams.
EE Times asked two design engineers to weigh in on the implications of the Act for engineers in the U.S., in the short and long term. Will it simply help return the design engineering process to status quo pre-2020? Or are there greater changes afoot that will drive a significant shakeup of the semiconductor design and manufacturing process? The answer lies somewhere in between.
To read the full article, click here
Related Semiconductor IP
- NFC wireless interface supporting ISO14443 A and B with EEPROM on SMIC 180nm
- DDR5 MRDIMM PHY and Controller
- RVA23, Multi-cluster, Hypervisor and Android
- HBM4E PHY and controller
- LZ4/Snappy Data Compressor
Related News
- Architect of CHIPS Act Speaks on Its Impact
- Strict Restrictions Imposed by US CHIPS Act Will Lower Willingness of Multinational Suppliers to Invest; Chinese Semiconductor Development Will Be Limited for Next Decade, Says TrendForce
- The European Chips Act has no clothes
- IoT will fire up the Next Generation of Engineers say ARM and UCL
Latest News
- CAST Releases First Dual LZ4 and Snappy Lossless Data Compression IP Core
- Arteris Wins “AI Engineering Innovation Award” at the 2025 AI Breakthrough Awards
- SEMI Forecasts 69% Growth in Advanced Chipmaking Capacity Through 2028 Due to AI
- eMemory’s NeoFuse OTP Qualifies on TSMC’s N3P Process, Enabling Secure Memory for Advanced AI and HPC Chips
- AIREV and Tenstorrent Unite to Launch Advanced Agentic AI Stack