Faraday Exhibits AI FPGA-to-ASIC Solution and IoT SoC Platform at DAC 2018
HSINCHU, Taiwan -- June 12, 2018 -- Faraday Technology Corporation (TWSE: 3035), a leading ASIC design service and IP provider, today announced that it will showcase their AI FPGA-to-ASIC solution and the Uranus+™ ultra-low-power IoT SoC development platform at Design Automation Conference (DAC), June 25-27, 2018 in San Francisco, CA, USA.
Faraday’s FPGA-to-ASIC conversion service has successfully completed several AI related projects including drone vision, medical image analysis, smart appliances, and 3D sensing. It brings remarkable power savings, enhanced performance, and lower system cost to meet specific AI requirements. By leveraging a comprehensive IP solutions suite and advanced FinFET process nodes, the service is particularly well suited for AI chips requiring higher bandwidth and a lower latency interface.
The demonstrated Uranus+ platform is a 32-bit MCU-based ultra-low-power SoC with embedded flash, implemented by UMC 55ULP technology, targeting to accelerate the development of IoT applications. It features DVFS power modes management to balance trade-offs between performance and power consumption. In particular, its Turbo Mode enables MCU core to achieve 2x performance under same operating voltage.
"We are very excited to present our latest ASIC solutions at DAC," said Flash Lin, Chief Operating Officer of Faraday. "Founded since 1993, we position ourselves as the driver of ASIC design service innovation. As the demand for AI ASIC chips is growing, we look forward to exploring more opportunities at the show and building strong business relationships in the US."
Visit Faraday’s booth at #2138 and find out the latest solutions from Faraday.
About Faraday Technology Corporation
Faraday Technology Corporation (TWSE: 3035) is a leading ASIC design service and IP provider, certified to ISO 9001 and ISO 26262. The broad silicon IP portfolio includes I/O, Cell Library, Memory Compiler, ARM-compliant CPUs, DDR2/3/4, low-power DDR1/2/3, MIPI, V-by-One, USB 2.0/3.1 Gen 1, 10/100/1000 Ethernet, Serial ATA, PCI Express, and programmable SerDes, etc. Headquartered in Taiwan, Faraday has service and support offices around the world, including the U.S., Japan, Europe, and China. For more information, visit www.faraday-tech.com.
Related Semiconductor IP
- UCIe Chiplet PHY & Controller
- MIPI D-PHY1.2 CSI/DSI TX and RX
- Low-Power ISP
- eMMC/SD/SDIO Combo IP
- DP/eDP
Related News
- Arm Drives Next-Generation Performance for IoT with World’s First Armv9 Edge AI Platform
- Faraday Accelerates AI Revolution with Its FPGA-to-ASIC Conversion Service
- Faraday Reports 2018 Annual Revenues of NT$4.91 Billion, NRE NT$1.3 Billion, up 107% YoY; 2018 Gross Margin was 53.1%, a 11 Year High
- Faraday Showcases FinFET ASIC Solutions and SoCreative!V SoC Platform at DAC 2019
Latest News
- Frontgrade Gaisler and wolfSSL Collaborate to Enhance Cybersecurity in Space Applications
- Digital Core Design Unveils DPSI5 - The Next-Generation IP Core for PSI5 Communication
- Matrox Video and intoPIX Expand Interoperable IPMX & ST 2110 Solutions with JPEG XS Innovation at NAB 2025
- HCLTech joins Samsung Advanced Foundry Ecosystem as a Design Solution Partner
- TeraSignal to Showcase Retimer-Less PCIe 6.0 over Optics Featuring Synopsys IP at OFC 2025