eInfochips Launches Industry's First DSP Based ATM SAR for Wireless Infrastructure applications
eXpressDSP⢠compliant solution on Texas Instruments' TMS320C64xTM generation, is an end-to-end, multi-channel solution for 3G communication infrastructure applications
Santa Clara, CA - Jan 28, 2004 - eInfochips Inc., a member of Texas Instruments (TI) third party program today announced the launch of ATM SAR, a flexible solution for next-generation wireless infrastructure applications. It consists of a complete stack, AAL2, AAL5 and ATM functionality. Further, eInfochips also announced that they are developing a high performance Voice Telephony over ATM (VToA) software solution that comprises of modules for Echo Cancellation, Speech Compression, Voice Activity Detection, Jitter Removal and Voice Packetization.
"We are proud to deliver the industry's first complete ATM stack offering for TI's TMS320C64x⢠generation DSPs," said Hitesh Thakkar, Marketing Manager, Embedded Systems Group of eInfochips Inc. "In addition we will extend our excellence in the ATM domain by integrating this with our Voice Telephony over ATM solution in the near future."
The ATM SAR is designed for high throughput by optimizing performance and memory utilization. AAL2, AAL5 and ATM are tested for interoperability with Motorola MPC8260 micro-code. The solution has several configurable options, including the number of virtual channels, configuration of ATM channels for transmit/receive operations, error handling & logging, and transmit/receive and reassembly buffering. It supports ITU-T recommendations. eXpressDSP⢠compliant code with user APIs and sample code makes it simple to integrate this solution with client applications.
Pricing and Availability
The complete solution, AAL2, AAL5 and ATM Layer is available now, and the bundled solution is priced at US$15,000.00. For more information please visit us at http://www.einfochips.com.
About eInfochips Inc.
eInfochips Inc., based in Santa Clara, is a leading provider of cutting edge ASIC design services, Embedded systems solutions and IP cores. The capabilities extend from Specification to Silicon, with knowledge spanning ASIC/SoC Design and verification, automated verification methodologies using HVL, eVC development, physical layout & implementation, firmware development, DSP hardware & algorithms and board design. The company's India and US design centers have delivered SoC and Embedded solutions to a variety of customers thus increasing their cost-effectiveness, reducing their time-to-market and growing their market strength. A partial list of customers includes Broadcom, LSI Logic, Cisco, Sun Microsystems, Philips, IDEO, Northrup Grumman.
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