Tiny Tapeout hit as eFabless closes
By Nick Flaherty, eeNews Europe (March 2, 2025)
eFabless, based in Palo Alto, California, had been struggling to raise funds in recent months. “Unfortunately, despite our best efforts, we were unable to complete our latest funding round, As a result, eFabless has shut down operations until further notice,” said Mike Wishart, CEO of eFabless, which provided an open source chip design flow as well as wafer shuttle services.
The company supported the Tiny Tapeout project that allows chip makers to use a multi-project wafer service for a few dollars. The current call is for designs for the TT10 run on the 130nm process at Skywater Technology..
To read the full article, click here
Related Semiconductor IP
- JESD204E Controller IP
- eUSB2V2.0 Controller + PHY IP
- I/O Library with LVDS in SkyWater 90nm
- 50G PON LDPC Encoder/Decoder
- UALink Controller
Related News
- RF startup Sequoia Communications shuts down
- ARM server chip pioneer Calxeda shuts down
- UMC may be forced to shut new fab pending EPA approval
- Virage Logic Drives Down Overall SOC Costs, While Targeting Higher Yielding Designs
Latest News
- PQSecure Collaborates with George Mason University on NIST Lightweight Cryptography Hardware Research
- Omni Design Technologies Advances 200G-Class Co-Packaged Optics IP Portfolio for Next-Generation AI Infrastructure
- Global Annual Semiconductor Sales Increase 25.6% to $791.7 Billion in 2025
- Fabless Startup Aheesa Tapes Out First Indian RISC-V Network SoC
- SmartDV and Mirabilis Design Announce Strategic Collaboration for System-Level Modeling of SmartDV IP