Tiny Tapeout hit as eFabless closes
By Nick Flaherty, eeNews Europe (March 2, 2025)
eFabless, based in Palo Alto, California, had been struggling to raise funds in recent months. “Unfortunately, despite our best efforts, we were unable to complete our latest funding round, As a result, eFabless has shut down operations until further notice,” said Mike Wishart, CEO of eFabless, which provided an open source chip design flow as well as wafer shuttle services.
The company supported the Tiny Tapeout project that allows chip makers to use a multi-project wafer service for a few dollars. The current call is for designs for the TT10 run on the 130nm process at Skywater Technology..
To read the full article, click here
Related Semiconductor IP
- DeWarp IP
- 6-bit, 12 GSPS Flash ADC - GlobalFoundries 22nm
- LunaNet AFS LDPC Encoder and Decoder IP Core
- ReRAM NVM in DB HiTek 130nm BCD
- UFS 5.0 Host Controller IP
Related News
- RF startup Sequoia Communications shuts down
- ARM server chip pioneer Calxeda shuts down
- UMC may be forced to shut new fab pending EPA approval
- Virage Logic Drives Down Overall SOC Costs, While Targeting Higher Yielding Designs
Latest News
- Global Semiconductor Sales Increase Substantially in February
- Hardware Root of Trust Essential for AI Chip Integrity
- AI Compute Demand Drives 44% YoY Growth for Top 10 Global Fabless IC Firms in 2025
- IBM Announces Strategic Collaboration with Arm to Shape the Future of Enterprise Computing
- Rambus Unveils HBM4E Controller: 16 GT/s, 2,048-Bit Interface, Enabling C-HBM4E