DMP releases AI Processor IP Core "ZIA DV740"
July 13, 2020 -- Digital Media Professionals Inc. (Headquarters: Nakano-ku, Tokyo, President & COO Tsuyoshi Osawa, hereinafter referred to as DMP) is pleased to announce the release of "ZIA™ DV740" (hereinafter referred to as "DV740"), the latest version of AI processor IP specialized for deep learning/AI (Artificial Intelligence) inference processing at the edge side.
DMP's AI processor IP "DV740" is an upgraded version of the existing "ZIA™ DV720", and is an ultra-low power consumption processor IP suitable for edge-side AI processing specialized for deep learning inference. It enables inference processing for all types of data such as images, videos, and audio.
Summary of DV740 upgrade
- Change neural network control processor from 32-bit RISC processor to small sequencer
- Supporting Open Neural Network Exchange (ONNX)
The DV740 is targeted at markets that require high-performance and highly accurate AI recognition processing such as robotic vehicle, surveillance camera, drones, and augmented reality (AR)/virtual reality (VR). DMP has started to provide it to some leading customers.
DMP will continue to contribute to the development of customers' edge AI applications by providing IP and module products.
Related Semiconductor IP
- Powerful AI processor
- AI Processor Accelerator
- High-performance AI dataflow processor with scalable vector compute capabilities
- AI DSA Processor - 9-Stage Pipeline, Dual-issue
- AI inference processor IP
Related News
- BrisbaneSilicon publishes Beta Release of its Lumorphix Processor IP Core
- Quadric’s Chimera GPNPU Named Best Edge AI Processor IP by Edge AI and Vision Alliance
- Kyocera Licenses Quadric’s Chimera GPNPU AI Processor IP
- See the 2025 Best Edge AI Processor IP at the Embedded Vision Summit
Latest News
- CAST Releases First Dual LZ4 and Snappy Lossless Data Compression IP Core
- Arteris Wins “AI Engineering Innovation Award” at the 2025 AI Breakthrough Awards
- SEMI Forecasts 69% Growth in Advanced Chipmaking Capacity Through 2028 Due to AI
- eMemory’s NeoFuse OTP Qualifies on TSMC’s N3P Process, Enabling Secure Memory for Advanced AI and HPC Chips
- AIREV and Tenstorrent Unite to Launch Advanced Agentic AI Stack