Chiplet Ecosystem Slowly Picks up Steam
By Dylan McGrath, EETimes
June 18, 2019
SANTA CLARA, Calif. — Momentum continues to coalesce slowly around the creation of an open chiplet ecosystem, enabling the heterogeneous integration of chiplets from multiple vendors in a system-in-package.
Chiplets represent one of several efforts to compensate for slowing performance gains through brute force scaling; it's the slowing of Moore's Law. While individual chip companies including Intel, Marvell, and startup zGlue — as well as system companies such as Cisco — have had some success in creating their own chiplet ecosystems, efforts to date have relied on proprietary multi-chip interfaces.
The development of an industry-wide open chiplet ecosystem that would allow designers to assemble "best of breed" chips incorporating components from multiple vendors requires not only standard open interfaces but also technology advancements in areas such as wafer testing and thermal management and the creation of new business models.
To read the full article, click here
Related Semiconductor IP
- 1.8V/3.3V I/O library with ODIO and 5V HPD in TSMC 16nm
- 1.8V/3.3V I/O Library with ODIO and 5V HPD in TSMC 12nm
- 1.8V to 5V GPIO, 1.8V to 5V Analog in TSMC 180nm BCD
- 1.8V/3.3V GPIO Library with HDMI, Aanlog & LVDS Cells in TSMC 22nm
- Specialed 20V Analog I/O in TSMC 55nm
Related News
- OpenFive Launches Die-to-Die Interface Solution for Chiplet Ecosystem
- DDR5 Ecosystem Ramps Up
- Leaders in Semiconductors, Packaging, IP Suppliers, Foundries, and Cloud Service Providers Join Forces to Standardize Chiplet Ecosystem
- Cadence Collaborates with Arm to Jumpstart the Automotive Chiplet Ecosystem
Latest News
- Will RISC-V reduce auto MCU’s future risk?
- Frontgrade Gaisler Launches New GRAIN Line and Wins SNSA Contract to Commercialize First Energy-Efficient Neuromorphic AI for Space Applications
- Continuous-Variable Quantum Key Distribution (CV-QKD) system demonstration
- Latest intoPIX JPEG XS Codec Powers FOR-A’s FA-1616 for Efficient IP Production at NAB 2025
- VeriSilicon Launches ISP9000: The Next-Generation AI-Embedded ISP for Intelligent Vision Applications