Chiplet Ecosystem Slowly Picks up Steam
By Dylan McGrath, EETimes
June 18, 2019
SANTA CLARA, Calif. — Momentum continues to coalesce slowly around the creation of an open chiplet ecosystem, enabling the heterogeneous integration of chiplets from multiple vendors in a system-in-package.
Chiplets represent one of several efforts to compensate for slowing performance gains through brute force scaling; it's the slowing of Moore's Law. While individual chip companies including Intel, Marvell, and startup zGlue — as well as system companies such as Cisco — have had some success in creating their own chiplet ecosystems, efforts to date have relied on proprietary multi-chip interfaces.
The development of an industry-wide open chiplet ecosystem that would allow designers to assemble "best of breed" chips incorporating components from multiple vendors requires not only standard open interfaces but also technology advancements in areas such as wafer testing and thermal management and the creation of new business models.
To read the full article, click here
Related Semiconductor IP
- Rad-Hard GPIO, ODIO & LVDS in SkyWater 90nm
- 1.22V/1uA Reference voltage and current source
- 1.2V SLVS Transceiver in UMC 110nm
- 1.8V/3.3V GPIO With I2C Compliant ODIO in GF 55nm
- Verification IP for UALink
Related News
- OpenFive Launches Die-to-Die Interface Solution for Chiplet Ecosystem
- DDR5 Ecosystem Ramps Up
- Leaders in Semiconductors, Packaging, IP Suppliers, Foundries, and Cloud Service Providers Join Forces to Standardize Chiplet Ecosystem
- Cadence Collaborates with Arm to Jumpstart the Automotive Chiplet Ecosystem
Latest News
- EXTOLL received GlobalFoundries Award for “Interface IP Partner of the Year”
- AiM Future and Franklin Wireless Sign MOU to Jointly Develop Lightweight AI Model and High-Efficiency 1 TOPS AI SoC Chipset
- GlobalFoundries and Silicon Labs Partner to Scale Industry-Leading Wi-Fi Connectivity
- GlobalFoundries Announces Availability of 22FDX+ RRAM Technology for Wireless Connectivity and AI Applications
- GlobalFoundries Announces Production Release of 130CBIC SiGe Platform for High-Performance Smart Mobile, Communication and Industrial Applications