Chinese startup foundry licenses Toshiba technology
Mike Clendenin, EE Times
(04/21/2006 6:24 AM EDT)
TAIPEI, Taiwan
(04/21/2006 6:24 AM EDT)
TAIPEI, Taiwan
— Startup IC Spectrum Co. Ltd. has inked a deal with Toshiba Corp. for the transfer of 0.35-micron manufacturing process technology, so that it can begin foundry work. The process will be used in the company’s 200-mm wafer fab currently under construction in Kunshan, northwest of Shanghai.
The fab is due to come on line early in 2007. By the end of 2008, it expects to be in volume production for 0.35-, 0.25- and 0.18-micron technologies. The company is building a monthly capacity of 35,000 wafers with its initial $450 million investment, which is roughly split between private equity and VC and government and local bank support.
To read the full article, click here
Related Semiconductor IP
- Rad-Hard GPIO, ODIO & LVDS in SkyWater 90nm
- 1.22V/1uA Reference voltage and current source
- 1.2V SLVS Transceiver in UMC 110nm
- Neuromorphic Processor IP
- Lossless & Lossy Frame Compression IP
Related News
- Weebit Nano licenses ReRAM to DB HiTek, a global top-10 foundry
- Siemens EDA faces Chinese startup competitor
- Fractile Licenses Andes Technology's RISC-V Vector Processor as It Builds Radical New Chip to Accelerate AI Inference
- Eliyan Ports Industry’s Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
Latest News
- GUC Monthly Sales Report – August 2025
- eSOL and Infineon Enter Strategic Partnership for Next-generation Automotive Platforms Based on RISC-V/TriCore/Arm Microcontrollers
- Synopsys and GlobalFoundries Establish Pilot Program to Bring Chip Design and Manufacturing to University Classrooms
- Cadence to Acquire Hexagon’s Design & Engineering Business, Accelerating Expansion in Physical AI and System Design and Analysis
- IntoPIX Receives 2025 Emmy® Award For The Development Of JPEG XS