CEVA to Showcase Leading DSP Cores and Integrated Solutions at 3GSM World Congress
San Jose, CA - February 18, 2004 - CEVA, Inc. (NASDAQ: CEVA; LSE: CVA), the leading licensor of Digital Signal Processor (DSP) cores and communications solutions to the semiconductor industry, today announced its demonstration line-up for this year's 3GSM World Congress in Cannes, France between February 23-26, 2004.
At Hall 5, hospitality suite M18, CEVA will be demonstrating its latest generation of DSP cores, tools and application platforms including:
- CEVA-X DSP Architecture - CEVA-X is a pioneering new DSP architecture that offers best-in-class performance, scalability and lowest cost-of-development in DSP deployment. Launched in late 2003, CEVA-X has already been adopted by leading handset and semiconductor companies.
- Xpert-Media™ - This new DSP powered audio and video media processing platform delivering audio, video and image processing for cellular, consumer multi-media and home entertainment markets. Based on proprietary patented video compression and decompression software acceleration technologies, Xpert-Media eliminates the need for current generation hardware acceleration and co-processors to the central chip.
- Xpert-GPS™ - Xpert-GPS is the latest generation of CEVA's high-performance GPS location platform. With the option of being powered by CEVA DSP cores, Xpert-GPS delivers the complete GPS solution, offering unrivalled performance in terms of accuracy, time-to-first-fix and power consumption.
- Xpert-Middleware - A complete middleware suite for CEVA DSPs with pre-defined software provides easy application development and multi-tasking run-time environment enabling parallel processing of multiple algorithms running concurrently on CEVA DSPs.
About CEVA, Inc.
For more information about CEVA, Inc, visit the about section of our website.
Related Semiconductor IP
- MIPI SoundWire I3S Peripheral IP
- MIPI SoundWire I3S Manager IP
- eDP 2.0 Verification IP
- Gen#2 of 64-bit RISC-V core with out-of-order pipeline based complex
- LLM AI IP Core
Related News
- Hantro, the market leader in mobile video technology, unveils its plans for 3GSM World Congress
- Hantro to unveil H.264/AVC hardware decoder at 3GSM World Congress
- CEVA to Demonstrate Software-Based H.264 and GPS Technologies for Wireless Devices at 3GSM World Congress 2005
- CEVA and Comsys to Demonstrate Comprehensive EDGE/GPRS/GSM Solution for Cellular Handsets at 3GSM World Congress 2005
Latest News
- Synopsys Spotlights Agentic AI, Accelerated Computing, and AI Physics at NVIDIA GTC Washington, D.C.
- Quintauris and HighTec EDV Systeme Join Forces to Advance RISC-V Ecosystem for Automotive
- GlobalFoundries Plans Billion-Euro Investment to Expand Chip Manufacturing in Germany
- Ceva and embedUR systems Partner to Launch ModelNova for NeuPro NPU Family, Expanding Edge AI Model Ecosystem
- Faraday Reports Third Quarter 2025 Results