CEVA Introduces Digital Video Stabilizer Software Module for CEVA-MM3000 Imaging & Vision Platforms Targeting Next Generation Smartphones and Mobile Devices
Low-power stabilizer utilizes advanced digital signal processing algorithms to reduce shakiness resulting from video capture using handheld devices
MOUNTAIN VIEW, Calif., Aug. 5, 2013 -- CEVA, Inc. (NASDAQ: CEVA), the leading licensor of silicon intellectual property (SIP) platform solutions and DSP cores, today announced the availability of its digital video stabilizer (DVS) software module for the CEVA-MM3000 imaging and vision platforms, bringing advanced imaging capabilities to next generation smartphones and mobile devices. The DVS module is fully optimized to run in real-time using minimal processing workloads and very low memory bandwidth on the CEVA-MM3000 platforms. For example, in a 28nm process, the CEVA-MM3101 consumes less than 35mW power while running DVS on a 1080p30 fps video stream in real-time. Addressing higher resolution requirements, the DVS module scales up to 4K Ultra-HD video streams on a single CEVA-MM3101 platform.
(Logo: http://photos.prnewswire.com/prnh/20120808/SF53702LOGO)
CEVA's DVS software module reduces the shakiness resulting from motion typically experienced when using the video and imaging functions in handheld devices such as smartphones and cameras. Features supported include rolling shutter ("Jello Effect") and multiple axis correction, which reduce shakiness and smooth motion when panning, zooming and rotating, in any light conditions. The DVS module was implemented utilizing CEVA's new Application Developer Kit (ADK), which was also announced today in a separate press release. The ADK serves to substantially simplify the overall software development experience, shortening the product design cycle and providing significant memory bandwidth and power consumption savings for imaging and vision applications.
Eran Briman, vice president of marketing at CEVA, commented: "Mobile device manufacturers are constantly on the lookout for differentiating features, most of which are aimed at enabling unique computational photography and vision applications. But even more important is the need to quickly implement such new features to meet product life cycles shorter than six months. Our DVS software module clearly illustrates the added value that the programmable CEVA-MM3000 family of imaging and vision platforms brings to OEMs, who can leverage the inherently low power consumption of DSPs to integrate advanced computational photography capabilities, in a timely and cost-efficient manner. Furthermore, our DVS module can be easily coupled with additional imaging software modules on the fully programmable CEVA-MM3000 platform such as Super-Resolution, Color Enhancement and High Dynamic Range."
Sample streams and more details on CEVA's DVS software module are available at http://www.ceva-dsp.com/DVS.
About CEVA, Inc.
CEVA is the world's leading licensor of silicon intellectual property (SIP) DSP cores and platform solutions for the mobile, portable and consumer electronics markets. CEVA's IP portfolio includes comprehensive technologies for cellular baseband (2G / 3G / 4G), multimedia (vision, imaging and HD audio), voice processing, Bluetooth, Serial Attached SCSI (SAS) and Serial ATA (SATA). In 2012, CEVA's IP was shipped in over 1.1 billion devices, powering smartphones from many of the world's leading OEMs, including HTC, Huawei, LG, Nokia, Motorola, Samsung, Sony, TCL and ZTE. Today, more than 40% of handsets shipped worldwide are powered by a CEVA DSP core. For more information, visit www.ceva-dsp.com.
Related Semiconductor IP
- HBM4 PHY IP
- eFuse Controller IP
- Secure Storage Solution for OTP IP
- Ultra-Low-Power LPDDR3/LPDDR2/DDR3L Combo Subsystem
- MIPI D-PHY and FPD-Link (LVDS) Combinational Transmitter for TSMC 22nm ULP
Related News
- MAXEYE License and Deploy CEVA Sensor Fusion Software in Digital Pen for Leading Global Mobile OEM
- Capturing Innovation: Logic Fruit Technologies Triumphs with ARINC 818 Video Processing and Switching Module Copyright
- Siemens extends support for Samsung Foundry's latest process technologies
- OKI IDS adopts Siemens Catapult High-Level Synthesis platform for design and verification services
Latest News
- LTSCT and Andes Technology Sign Strategic IP Licensing Master Agreement to accelerate RISC-V Based Advanced Semiconductor Solutions
- Global Semiconductor Sales Increase 29.8% Year-to-Year in November
- BAE Systems Licenses Time Sensitive Networking (TSN) Ethernet IP Cores from CAST
- HBM4 Mass Production Delayed to End of 1Q26 By Spec Upgrades and Nvidia Strategy Adjustments
- ASICLAND Secures USD 17.6 Million Storage Controller Mass Production Contract