ARM exec slotted as next VSIA president
ARM exec slotted as next VSIA president
By Michael Santarini, EE Times
March 7, 2000 (3:26 p.m. EST)
URL: http://www.eetimes.com/story/OEG20000307S0020
SAN MATEO, Calif. Timothy O'Donnell, president of ARM Inc., has been appointed vice president of the Virtual Socket Interface Alliance (VSIA), and will succeed Howard Sachs as president of the intellectual property (IP) standards body in September. O'Donnell will be the first VSIA president to come from a third-party IP supplier. "It will be great to have an IP provider heading up the VSIA," said Sachs. "As one of the founding member companies of VSIA, ARM has been very active in helping to grow the organization and establish a unifying vision for the system-on-chip industry." O'Donnell has been president of ARM Inc. since he established the U.S.-based operation of ARM Ltd. (Cambridge, England) in 1991. He was instrumental in establishing ARM's U.S. presence as a semiconductor IP provider, and has been a leading advocate of the advantages of IP as a system-on- chip design methodology, VSIA said. O'Donnell has more than 25 years experience in international management and technical positions within the semiconductor industry, including posts with National Semiconductor Corp. and Cadence Design Systems Inc. He earned a M.S.E.E. from the University of California, Irvine, and a B.S. in physics from Harvey Mudd College (Claremont, Calif.).
Related Semiconductor IP
- JESD204E Controller IP
- eUSB2V2.0 Controller + PHY IP
- I/O Library with LVDS in SkyWater 90nm
- 50G PON LDPC Encoder/Decoder
- UALink Controller
Related News
- Arm Announces Appointment of Eric Hayes as Executive Vice President, Operations
- Codasip Welcomes Jerry Ardizzone to Executive Team as Vice President of Worldwide Sales
- Rambus Appoints Luc Seraphin as President and Chief Executive Officer
- SiFive Appoints Patrick Little as President and Chief Executive Officer
Latest News
- Cerebras Systems Raises $1 Billion Series H
- Positron AI Raises $230 Million Series B at Over $1 Billion Valuation to Scale Energy-Efficient AI Inference
- EvertzAV Successfully Integrates IntoPIX JPEG XS Temporal Differential Coding Into Its IPMX-Certified NUCLEUS Platform
- SoftBank Corp. Subsidiary SAIMEMORY and Intel Collaborate to Commercialize Next-generation Memory Technology
- TES is extending its PMU IP portfolio for X-FAB’s XT018 - 0.18µm BCD-on-SOI technology.