Apple, TSMC and the Seven Customers of 16FF+
Peter Clarke, Electronics360
14 November 2014
Foundry Taiwan Semiconductor Manufacturing Co. Ltd. has announced that its 16nm FinFET Plus (16FF+) process is now in risk production and that it expects volume production to being around July 2015. That should be about six months behind the original 16FF process, according to earlier statements. TSMC has also quoted seven customers of the 16FF+ process in a press release, presumably hoping to demonstrate that 16FF+ is a safe bet and to encourage yet more customers turn away from the blandishments of the Samsung-Globalfoundries and Intel FinFET offerings at 14nm.
Some are arguing that this acceleration and mass support for 16FF+ means that TSMC is not going to lag Samsung in FinFET process introduction and provides encouragement that TSMC can win the next-generation Apple A9 application processor business.
To read the full article, click here
Related Semiconductor IP
- HBM4 PHY IP
- Ultra-Low-Power LPDDR3/LPDDR2/DDR3L Combo Subsystem
- MIPI D-PHY and FPD-Link (LVDS) Combinational Transmitter for TSMC 22nm ULP
- HBM4 Controller IP
- IPSEC AES-256-GCM (Standalone IPsec)
Related News
- Teardown.com Analysis: Apple iPhone 6 Plus
- iPhone 6 Plus: $100 Costlier for Consumers to Buy - Just $15.50 More Expensive for Apple to Make
- Upgraded Components in iPhone 6S Plus Costs Apple an Extra $16 Per Device
- TSMC opens Tainan fab, plus 300-mm pilot line
Latest News
- AI Directs UFS Advancement
- Qualitas Semiconductor Expands Automotive Momentum with 5nm IP Bundle Agreement
- Cyient Semiconductors Acquires Majority Stake in Kinetic Technologies to Drive Custom Power IC Leadership for Edge AI and High-Performance Compute Markets
- Rivian Unveils Custom Silicon, Next-Gen Autonomy Platform, and Deep AI Integration
- NanoXplore raises €20 million from MBDA and Bpifrance to accelerate its diversification into defense and its growth in support of European strategic sovereignty