Analysis gives first look inside Apple's A4 processor
Apple's iPad chip is a single-core ARM A8 made by Samsung
By Young Choi, UBM TechInsights
EE Times (05/07/10, 12:50:00 PM EDT)
OTTAWA — The entire world is fascinated, again, by the latest mobile gadget from Apple, the iPad. Speculation and rumors about the Apple A4 applications processor inside the iPad abound.
UBM TechInsights has analyzed the iPad and the A4 to establish some facts about the product and the processor. (UBM TechInsights is a division of United Business Media, the publisher of EE Times.)
We've conducted product teardowns, detailed process technology and functional layout analyses, functional testing, and power consumption measurements of the iPad. Our library of analysis of Apple's products—stretching back to the original iPhone—enabled us to arrive at some concrete conclusions regarding the technology, power consumption and processor characteristics of this important element of Apple’s latest product.
To help understand Apple's efforts in applications processors, it is useful to look at the history of Apple's applications processors from the original iPhone introduced in 2007 to the latest iPad.
To read the full article, click here
Related Semiconductor IP
- NFC wireless interface supporting ISO14443 A and B with EEPROM on SMIC 180nm
- DDR5 MRDIMM PHY and Controller
- RVA23, Multi-cluster, Hypervisor and Android
- HBM4E PHY and controller
- LZ4/Snappy Data Compressor
Related News
- Renesas' New Ultra-High Performance MCUs are Industry's First Based on Arm Cortex-M85 Processor
- Nordic Semiconductor and Arm reaffirm partnership with licensing agreement for latest low power processor designs, software platforms, and security IP
- C-DAC partners with MosChip and Socionext for design of HPC Processor AUM based on Arm architecture
- Comment: Inside Apple's A4 processor
Latest News
- CAST Releases First Dual LZ4 and Snappy Lossless Data Compression IP Core
- Arteris Wins “AI Engineering Innovation Award” at the 2025 AI Breakthrough Awards
- SEMI Forecasts 69% Growth in Advanced Chipmaking Capacity Through 2028 Due to AI
- eMemory’s NeoFuse OTP Qualifies on TSMC’s N3P Process, Enabling Secure Memory for Advanced AI and HPC Chips
- AIREV and Tenstorrent Unite to Launch Advanced Agentic AI Stack