AI Can't Design Chips Without People
By Gary Hilson, EETimes (Jluy 4, 2023)
Machines are already building other machines, so it makes sense that artificial intelligence would help build the components necessary for them to exist, including processors and memory devices. But we’re a long way from AI replacing design engineers; the immediate benefits of machine learning (ML) and algorithms are the productivity gains that come with speeding up tedious, time-consuming tasks.
Recent research from Accenture’s annual Technology Vision report on generative AI found that 69% of global high-tech executives expect their organizations to benefit from accelerated innovation thanks to AI. Syed Alam, a high-tech industry lead at Accenture, told EE Times in an exclusive interview that manufacturing and supply chains are areas where generative AI is being explored to support the chipmaking process.
To read the full article, click here
Related Semiconductor IP
- USB 20Gbps Device Controller
- 25MHz to 4.0GHz Fractional-N RC PLL Synthesizer on TSMC 3nm N3P
- AGILEX 7 R-Tile Gen5 NVMe Host IP
- 100G PAM4 Serdes PHY - 14nm
- Bluetooth Low Energy Subsystem IP
Related News
- Positron Secures $23.5M to Design And Manufacture Energy-Efficient, Made-In-America AI Chips
- Cadence and TSMC Advance AI and 3D-IC Chip Design with Certified Design Solutions for TSMC’s A16 and N2P Process Technologies
- Thalia enhances AMALIA Platform with new AI models to revolutionize analog, RF and mixed-signal IC design migration
- Imec coordinates EU Chips Design Platform
Latest News
- 2025 TSMC OIP Ecosystem Forum Highlights Aion Silicon’s Leadership in Advanced SoC Design
- Ceva Appoints Former Microsoft AI and Hardware Leader Yaron Galitzky to Accelerate Ceva’s AI Strategy and Innovation at the Smart Edge
- Dnotitia Unveils VDPU IP, the First Accelerator IP for Vector Database
- Ambient Scientific AI-native processor for edge applications offers 100x power and performance improvements over 32-bit MCUs
- Qualitas Semiconductor Signs PCIe Gen 4.0 PHY IP License Agreement with Leading Chinese Fabless Customer