AccelerComm opens office in Shanghai to exploit Asian market growth in telecommunications
November 27, 2018 -- Southampton, UK -- AccelerComm has today announced they have opened their first regional office, selecting Shanghai, China due to the growing demand for high performance communication IP in the region.
China is driving the research and development of advanced communication systems as they strive to be the dominant economy in the telecommunications industry. Both high-performance hardware and software IP from AccelerComm like Polar and LDPC channel coding for 5G NR are required to meet the next generation of cellular standards.
According to a GSMA report on Mobile Economy in 2018, China offers the largest revenue growth opportunity for operators. Especially beyond 2020, China will account for around 40% of global mobile revenue growth between 2017 and 2025.
About AccelerComm
AccelerComm provides LDPC, polar and turbo solutions which enable optimal performance
of communication systems, and solves the challenges that would otherwise limit the speed
of next generation communications, namely the error correction decoding that is required to
overcome the effects of noise, interference and poor signal strength.
For further information visit: www.accelercomm.com.
Related Semiconductor IP
- Multi-channel, multi-rate Ethernet aggregator - 10G to 400G AX (e.g., AI)
- Multi-channel, multi-rate Ethernet aggregator - 10G to 800G DX
- 200G/400G/800G Ethernet PCS/FEC
- 50G/100G MAC/PCS/FEC
- 25G/10G/SGMII/ 1000BASE-X PCS and MAC
Related News
- CEVA Expands Global Presence with New Sales and Support Office in Shanghai, China
- Global Unichip Announces Opening of the GUC Shanghai Office in China
- Silicon Image Opens New Research & Development Center And Sales Office In Shanghai, China
- Chips&Media Opens New Sales and Support Office in Shanghai, China
Latest News
- How CXL 3.1 and PCIe 6.2 are Redefining Compute Efficiency
- Secure-IC at Computex 2025: Enabling Trust in AI, Chiplets, and Quantum-Ready Systems
- Automotive Industry Charts New Course with RISC-V
- Xiphera Partners with Siemens Cre8Ventures to Strengthen Automotive Security and Support EU Chips Act Sovereignty Goals
- NY CREATES and Fraunhofer Institute Announce Joint Development Agreement to Advance Memory Devices at the 300mm Wafer Scale