Unveiling the Availability of Industry's First Silicon-Proven 3nm, 24Gbps UCIe™ IP Subsystem with TSMC CoWoS® Technology 2024-09-30 14:14:00 IP
Global Semiconductor Industry Plans to Invest $400 Billion in 300mm Fab Equipment Over Next Three Years, SEMI Reports 2024-09-30 09:03:00 Commentary / Analysis
Alphawave Semi Wins Fifth Consecutive TSMC OIP Ecosystem Forum Partner of the Year Award 2024-09-26 19:15:00 Other
SIAE Microelettronica Selects Ensilica as Key Partner to Design ASICs for Next-Generation Telecom Equipment 2024-09-26 13:33:00 Deals
Synopsys and TSMC Pave the Path for Trillion-Transistor AI and Multi-Die Chip Design 2024-09-26 09:23:00 EDA
TSMC and Cadence Collaborate to Deliver AI-Driven Advanced-Node Design Flows, Silicon-Proven IP and 3D-IC Solutions 2024-09-26 09:22:00 EDA
Siemens extends collaboration with TSMC to advance integrated circuit and systems design 2024-09-26 08:38:00 EDA
EXTOLL collaborates with BAE Systems as a Key Partner for High-Speed SerDes IP 2024-09-26 07:19:00 Deals
eMemory Won TSMC OIP Partner of the Year Award for the Outstanding Development of its NVM IP on Advanced Nodes 2024-09-26 06:48:00 Other
Silicon Creations Awarded TSMC's 2024 Open Innovation Platform Partner of the Year for Mixed Signal IP 2024-09-26 05:30:00 Other
MIPI Alliance Releases A-PHY v2.0, Doubling Maximum Data Rate of Automotive SerDes Interface To Enable Emerging Vehicle Architectures 2024-09-26 04:27:00 Other
Preferred Networks Inc. adopts Siemens' PowerPro software for next-generation AI chip design 2024-09-25 12:04:00 EDA
Alphawave Semi and Arm to Present on Chiplets for Architecting Next-Generation Terabit AI Networks at the TSMC OIP Ecosystem Forum North America 2024-09-25 03:38:00 Other
Introducing a Versatile 1G Ethernet PHY IP Core with BroadR-Reach™ Technology for Automotive and Industrial Applications 2024-09-25 01:56:00 Other
Silvaco Expands its Victory TCAD and Digital Twin Modeling Platform to Planar CMOS, FinFET and Advanced CMOS Technologies 2024-09-25 01:09:00 EDA