Siemens delivers a major leap toward mainstream 3D-IC adoption with new Calibre 3DThermal 2024-06-25 08:52:00 EDA
Siemens introduces Innovator3D IC - a comprehensive multiphysics cockpit for 3D IC design, verification and manufacturing 2024-06-25 08:50:00 EDA
Enosemi announces availability of C-band-compatible electronic-photonic design IP 2024-06-25 08:05:00 IP
Synopsys Accelerates Chip Innovation with Production-Ready Multi-Die Reference Flow for Intel Foundry 2024-06-25 06:55:00 EDA
ESWIN Computing Pairs SiFive CPU, Imagination GPU and In House NPU in Latest RISC-V Edge Computing SoC 2024-06-25 06:03:00 Embedded Systems
CEA-Leti Announces Launch of FAMES Pilot Line As Part of EU Chips Act Initiative 2024-06-25 04:28:00 Foundries
X-Silicon Introduces the World's First Vulkan Driver Implementation for RISC-V, Enabling an entire Ecosystem of 3D Graphics, AI and Compute for Low-Power, Mobile, Edge and IOT Devices 2024-06-25 02:40:00 Embedded Systems
SignatureIP Makes Network-on-Chip (NoC) Design Widely Accessible with Cloud-Based iNoCulator™ Platform 2024-06-24 17:06:00 IP
Baya Systems and Blue Cheetah Partner to Deliver Chiplet Interconnect Solutions 2024-06-24 16:22:00 IP
Ceva Extends its Smart Edge IP Leadership, Adding New TinyML Optimized NPUs for AIoT Devices to Enable Edge AI Everywhere 2024-06-24 13:54:00 IP
True Circuits Introduces the JSPICE™ Design Environment (JDE™) at the Design Automation Conference 2024-06-24 10:22:00 Other
Semiwise, sureCore, and Cadence Showcase Breakthrough in Cryogenic CMOS Circuit Development for Quantum Computing and Energy-Efficient Data Centers 2024-06-24 07:37:00 EDA
Crypto Quantique, ZARIOT and Kigen unveil quantum-safe hardware root-of-trust for cellular IoT 2024-06-24 07:24:00 Embedded Systems
Siemens delivers AI- accelerated verification for analog, mixed-signal, RF, memory, library IP and 3D IC designs in Solido Simulation Suite 2024-06-24 03:42:00 EDA
T2M-IP Announces Silicon-Proven MIPI D-PHY v2.5 Tx and DSI-2 Tx Controller Low-Power, Cost-Effective IP Cores Solutions for Advanced SoCs 2024-06-24 01:46:00 Other
Tenstorrent Licenses Baya Systems' Fabric into next-generation AI and Compute Chiplet Solutions 2024-06-21 21:52:00 Deals
Baya Systems Introduces New Technology to Transform SoCs and Chiplets for Emerging Applications 2024-06-21 13:48:00 IP
Andes Technology Showcases Leadership in AI and Automotive Applications at RISC-V Summit Europe 2024 2024-06-21 12:57:00 Other