Perceptia Devices Appoints Vector and SMC as its Korean Representatives
2017-07-03 14:26:00
Strategic Partnerships
Chiplet News Archive - Page 560 of 1946
ARM and Hyper Team to Bring Secure Container for IoT, Edge and 5G
2017-07-03 13:36:00
SoC Architecture & Assembly
iFLYTEK On-Device Speech Recognition Software Now Available For CEVA's Ultra-Low Power Audio/Voice DSPs
2017-06-30 07:51:00
SoC Architecture & Assembly
Embedded MRAM Can Take the Heat
2017-06-29 15:32:00
Analysis & Insight
Microsemi Announces General Availability of Engineering Samples for its Lowest Power, Cost-Optimized Mid-Range PolarFire FPGAs
2017-06-29 14:12:00
SoC Architecture & Assembly
Exosite Collaboration with ARM Provides Secure, Full-Stack IoT Solution
2017-06-29 09:21:00
SoC Architecture & Assembly
Kyocera Selects Synopsys VC Formal for High-Performance Property Verification
2017-06-28 15:07:00
EDA & Design Tools
eASIC Recognizes Growth in Demand From China and Establishes eASIC Shenzhen WFOE
2017-06-28 13:36:00
Strategic Partnerships
Argon Design joins Alliance for Open Media, AOM
2017-06-28 13:25:00
Misc
VeriSilicon Unveils Vivante 2 Teraflop "MESH" Architecture Compute IP Cores for Embedded Devices
2017-06-28 11:50:00
IP Cores & Design
Intel FPGA Technology Supports NEC in Face Recognition Technology
2017-06-28 09:43:00
SoC Architecture & Assembly
ArcSoft and CEVA Partner to Raise the Performance Level of Smartphone Cameras
2017-06-28 09:27:00
SoC Architecture & Assembly
Dolphin Integration Selects Silvaco Variation Manager eXtreme Memory Analysis for SRAM Design At Advanced Nodes
2017-06-28 09:08:00
EDA & Design Tools
MPEG LA Introduces License for EVS
2017-06-28 09:04:00
Misc
PiSoft Partners with Rockchip and CEVA to Develop 360 Degree Panoramic Camera Solution
2017-06-28 08:45:00
Commercial Deals
Lattice Semiconductor Delivers New Machine Learning and Sensor-to-Cloud Security Solutions for Intelligence at the Edge
2017-06-27 15:15:00
SoC Architecture & Assembly
New Enhancements to Microsemi's Imaging/Video Solution Enable Customers to Leverage Company's Low Power and High Security FPGAs in MIPI CSI-2-Based Camera Systems
2017-06-27 13:58:00
SoC Architecture & Assembly
CommSolid and Rohde & Schwarz Completed First NB-IoT GCF Test Campaign
2017-06-27 12:20:00
Misc
New Moortec Webinar: Embedded monitoring - How to optimise power and speed of FinFET based designs
2017-06-27 01:28:00
Misc
ICE-P3 EPU Integrates Temperature-Compensated Voltage And Frequency Control For Maximum Energy Savings
2017-06-26 17:03:00
IP Cores & Design