92 IC Wafer Fabs Closed or Repurposed From 2009-2017
2018-03-05 05:33:00
Analysis & Insight
Chiplet News Archive - Page 517 of 1946
CEVA and Nokia Collaborate for 4.9G and 5G Technologies
2018-03-01 08:16:00
Strategic Partnerships
Brite Semiconductor Releases Gen2 DDR LP PHY IP
2018-03-01 07:49:00
IP Cores & Design
Imec and Cadence Tape Out Industry's First 3nm Test Chip
2018-02-28 17:12:00
EDA & Design Tools
GOWIN Semiconductor selects PLDA XpressRICH3 Controller IP as the PCIe interface block in their FPGA product line
2018-02-28 15:24:00
Commercial Deals
GreenWaves Technologies Unveils GAP8, the Industry's Lowest Power IoT Application Processor, Enabling Groundbreaking Embedded Artificial Intelligence at the Very Edge
2018-02-28 14:00:00
SoC Architecture & Assembly
S3 Semiconductors joins Arm Approved design partner program
2018-02-28 13:25:00
Strategic Partnerships
Trinamic Licenses Codasip's Bk3 RISC-V Processor for Next Generation Motion Control Applications
2018-02-28 10:21:00
Commercial Deals
Truechip Announces First Customer Shipment of PCIe Gen 5 and JESD204C Verification IP
2018-02-27 17:29:00
Verification IP
Northwest Logic's Expresso 4.0 Controller Core and Fidus Systems' Zynq UltraScale+ Platform demonstrates PCIe 4.0 Support
2018-02-27 15:35:00
IP Cores & Design
GLOBALFOUNDRIES Strengthens 22FDX eMRAM Platform with eVaderis' Ultra-low Power MCU Reference Design
2018-02-27 15:23:00
IP Cores & Design
AccelerComm and Achronix Enable Fast Time to Market with 5G Polar Code for Speedcore eFPGAs
2018-02-27 15:18:00
IP Cores & Design
Flex Logix Co-Founder Cheng Wang Awarded Interconnect Patent For Tiling of eFPGA Cores to Create Wide Range of Larger eFPGA Arrays
2018-02-27 14:24:00
Legal & IP Strategy
Arteris IP FlexNoC Interconnect Licensed by AutoChips for Automotive SoC Development
2018-02-27 13:00:00
Commercial Deals
Neural Network Inference Engine IP Core Delivers >10 TeraOPS per Watt
2018-02-27 12:29:00
IP Cores & Design
Maxim's Dynamic Speaker Management Technology Running on the CEVA-TeakLite-4 Ultra-Low-Power DSP Provides the Ultimate Sound Experience from Micro Speakers
2018-02-27 10:50:00
SoC Architecture & Assembly
Nuance Voice Activation Technology Now Available for CEVA-TeakLite Family, World's Lowest Power Audio/Voice DSPs
2018-02-27 10:42:00
SoC Architecture & Assembly
Single-Chip Custom Solutions for the IoT Edge
2018-02-27 10:30:00
SoC Architecture & Assembly
Sonics Partners With Inomize To Enable Automotive Chip Design For ISO 26262 Standard
2018-02-27 10:23:00
IP Cores & Design
OPENAIRINTERFACE software stack powering 5G use-cases exhibited at Mobile World Congress Barcelona
2018-02-27 08:01:00
Misc