Taiwan Maintains The Largest Share of Global IC Wafer Fab Capacity 2019-02-14 08:13:00 Commentary / Analysis
CEVA, Inc. Announces Fourth Quarter and Year End 2018 Financial Results 2019-02-13 13:10:00 Financial
Silicon Creations' PLL Technology Contributes to the First 7nm Mass Production Mining Chip 2019-02-13 07:05:00 Deals
200mm Fabs to Add 700,000 Wafers Through 2022, SEMI Reports 2019-02-12 15:53:00 Commentary / Analysis
Andes Technology Corp. Targets Deeply Embedded Protocol Processing and Entry-level MCUs With the New N22, the Smallest RISC-V Core in its V5 Family 2019-02-12 11:37:00 IP
Achronix Announces Partner Program for Speedster, Speedchip, and Speedcore Ecosystem 2019-02-12 08:27:00 Business
ISSCC 2019: eSilicon to present a paper and demonstrate 7nm 56G DSP SerDes operation over a five-meter cable assembly 2019-02-12 08:19:00 Other
Pliops Raises $30 Million in Series B Funding Led by SoftBank Ventures Asia to Transform Data Center Infrastructure for Cloud, AI and ML 2019-02-12 01:20:00 Business
AIStorm Raises $13.2M to Bring Real-Time AI-in-Sensor Technology to the Edge at a Fraction of the Cost 2019-02-11 15:03:00 Business
TDK-Micronas renews its trust in Dolphin Integration's RAM and ROM Silicon IPs 2019-02-11 11:31:00 Deals
China IC Production Forecast to Show a Strong 15% 2018-2023 CAGR 2019-02-08 13:13:00 Commentary / Analysis
SoC-e networking IP porfolio extends with SpaceWire: The standard for Spacecraft communication networks 2019-02-08 09:33:00 IP
New intoPIX FlinQ Image Technology Empowers Next Generation DM NVX Network AV 2019-02-07 07:36:00 Deals