Tempow and CEVA Partner to Deliver Low Power, Low Latency True Wireless Stereo Technology for Bluetooth Earbuds 2018-11-28 13:24:00 Deals
Efabless Launches the Chiplicity Design Partner Program Featuring Chipus Microelectronics, Sankalp Semiconductor and Symmid Corporation 2018-11-28 12:36:00 Other
The Linux Foundation and RISC-V Foundation Announce Joint Collaboration to Enable a New Era of Open Architecture 2018-11-28 11:55:00 Other
Allegro DVT Launches a new High-Performance, Multi-Format Video Encoder IP for 4K/UHD Video Resolutions and Beyond 2018-11-28 10:03:00 IP
PLDA and Samtec Demonstrate PCIe 4.0 Communication over Twinax Cables Allowing Full 16GT/s PCIe 4.0 Bandwidth at Minimal Manufacturing Cost 2018-11-27 13:39:00 IP
AccelerComm opens office in Shanghai to exploit Asian market growth in telecommunications 2018-11-27 13:24:00 Other
Zhuhai Chuangfeixin Introduces eNOR Embedded Flash Memory IP Solution and SPI NOR Flash Products on 65nm Floating-Gate Flash Process 2018-11-27 13:19:00 IP
Sonova License and Deploy CEVA Bluetooth IP in SWORD 3.0 Wireless Chip for Hearing Aids 2018-11-27 13:04:00 Deals
PLDA Offers XpressRICH PCIe and CCIX Controller IP Through SiFive DesignShare Program 2018-11-26 15:53:00 Business
IAR Systems Expands Support for Arm DesignStart with High Performance Tools for Arm Cortex-A5 2018-11-26 14:44:00 Embedded Systems
Only Qualcomm Reported to Post Slight Decline Among Top Ten Fabless IC Design Houses by 3Q18 Revenue, Says TrendForce 2018-11-26 14:22:00 Commentary / Analysis
Express Logic Provides Support for Infineon TriCore Microcontrollers 2018-11-26 02:11:00 Embedded Systems
Winbond and Tiempo Secure join forces to offer the world's first fully CC EAL5+ certifiable Secure Element IP for IoT 2018-11-22 08:53:00 IP