INGChips selects Dolphin Integration's Power Management IP Platform for its ultra Low Power Bluetooth Low-Energy SoC in 40 nm eFlash
2019-05-20 10:46:00
Deals
Recent News
Cadence Palladium and Protium Platforms Enable Innovium to Accelerate First-Pass Silicon Success for the Data Center Market
2019-05-20 02:45:00
EDA
Intrinsic ID Secures EUR 11 Million Loan from European Investment Bank
2019-05-17 12:11:00
Business
Intel Recaptures Number One Quarterly Semi Supplier Ranking from Samsung
2019-05-17 10:41:00
Commentary / Analysis
lowRISC Expands and Appoints New Members to the Board of Directors from Google and ETH Zurich
2019-05-17 10:27:00
People
SmartDV Reduces Protocol Debug Time with Smart ViPDebug
2019-05-16 16:13:00
EDA
Making virtual more of a reality with the new Arm Mali-D77 display processor
2019-05-15 19:32:00
IP
New Cadence Tensilica Vision Q7 DSP IP Doubles Vision and AI Performance for Automotive, AR/VR, Mobile and Surveillance Markets
2019-05-15 17:12:00
IP
Arm demonstrates new IoT test chip and board for highly efficient, secure IoT designs
2019-05-15 14:05:00
Embedded Systems
Samsung Electronics' Leadership in Advanced Foundry Technology Showcased with Latest Silicon Innovations and Ecosystem Platform
2019-05-15 13:30:00
Foundries
AI Chipmaker Hailo Releases Industry-Leading Deep Learning Processor
2019-05-15 13:21:00
Chip
eSilicon Announces Production Qualification of 5G Infrastructure ASIC
2019-05-15 11:03:00
IP
Cadence Announces Broad Next-Generation Memory Standard Support in Samsung Foundry's Advanced Process Technologies
2019-05-15 10:59:00
IP
Cadence Tapes Out 112G Long-Reach SerDes IP on Samsung Foundry's 7LPP Process Technology
2019-05-15 10:54:00
IP
Silicon Labs Partners with Pulsic, Selecting Animate as Its Automated Layout Solution for Analog IC Designs
2019-05-15 01:28:00
EDA
Arteris IP FlexNoC Interconnect and Resilience Package Licensed by Black Sesame for ISO 26262-Compliant AI Chips for ADAS
2019-05-14 13:26:00
Deals
Synopsys and Arm Extend Collaboration to Fusion Compiler to Accelerate Implementation of Arm's Next-Generation Client and Infrastructure Cores
2019-05-14 12:57:00
EDA
EDA Vendors Spread Wings as Market Softens
2019-05-14 12:53:00
Commentary / Analysis
Wave Computing Adds MIPS32 microAptiv Cores to MIPS Open Program
2019-05-14 12:42:00
IP
Tiempo Secure Joins Deutsche Telekom's nuSIM Partnering Network
2019-05-14 07:16:00
Other
Cadence Palladium and Protium Platforms Enable Innovium to Accelerate First-Pass Silicon Success for the Data Center Market
2019-05-20 02:45:00
EDA
Intrinsic ID Secures EUR 11 Million Loan from European Investment Bank
2019-05-17 12:11:00
Business
Intel Recaptures Number One Quarterly Semi Supplier Ranking from Samsung
2019-05-17 10:41:00
Commentary / Analysis
lowRISC Expands and Appoints New Members to the Board of Directors from Google and ETH Zurich
2019-05-17 10:27:00
People
SmartDV Reduces Protocol Debug Time with Smart ViPDebug
2019-05-16 16:13:00
EDA
Making virtual more of a reality with the new Arm Mali-D77 display processor
2019-05-15 19:32:00
IP
New Cadence Tensilica Vision Q7 DSP IP Doubles Vision and AI Performance for Automotive, AR/VR, Mobile and Surveillance Markets
2019-05-15 17:12:00
IP
Arm demonstrates new IoT test chip and board for highly efficient, secure IoT designs
2019-05-15 14:05:00
Embedded Systems
Samsung Electronics' Leadership in Advanced Foundry Technology Showcased with Latest Silicon Innovations and Ecosystem Platform
2019-05-15 13:30:00
Foundries
AI Chipmaker Hailo Releases Industry-Leading Deep Learning Processor
2019-05-15 13:21:00
Chip
eSilicon Announces Production Qualification of 5G Infrastructure ASIC
2019-05-15 11:03:00
IP
Cadence Announces Broad Next-Generation Memory Standard Support in Samsung Foundry's Advanced Process Technologies
2019-05-15 10:59:00
IP
Cadence Tapes Out 112G Long-Reach SerDes IP on Samsung Foundry's 7LPP Process Technology
2019-05-15 10:54:00
IP
Silicon Labs Partners with Pulsic, Selecting Animate as Its Automated Layout Solution for Analog IC Designs
2019-05-15 01:28:00
EDA
Arteris IP FlexNoC Interconnect and Resilience Package Licensed by Black Sesame for ISO 26262-Compliant AI Chips for ADAS
2019-05-14 13:26:00
Deals
Synopsys and Arm Extend Collaboration to Fusion Compiler to Accelerate Implementation of Arm's Next-Generation Client and Infrastructure Cores
2019-05-14 12:57:00
EDA
EDA Vendors Spread Wings as Market Softens
2019-05-14 12:53:00
Commentary / Analysis
Wave Computing Adds MIPS32 microAptiv Cores to MIPS Open Program
2019-05-14 12:42:00
IP
Tiempo Secure Joins Deutsche Telekom's nuSIM Partnering Network
2019-05-14 07:16:00
Other