SiFive Intelligence for Modern ML Architectures Presentation at Linley Spring Processor Conference
2021-04-09 09:09:00
Misc
Chiplet News Archive - Page 317 of 1945
Cadence Collaborates with Samsung Foundry to Accelerate Hyperscale Computing SoC Design for Process Nodes Down to 4nm
2021-04-09 08:57:00
EDA & Design Tools
Cadence Delivers Automotive Reference Flow for Samsung Foundry 14LPU Process Technology
2021-04-09 08:54:00
EDA & Design Tools
Atmosic Technologies' New Reference Designs Bring the Power of Photovoltaic-harvested Energy to IoT Manufacturers
2021-04-09 08:47:00
SoC Architecture & Assembly
Achronix Now Shipping Industry's Highest Performance Speedster7t FPGA Devices
2021-04-09 08:39:00
SoC Architecture & Assembly
Startup Transforms Compute-In-Memory
2021-04-08 11:33:00
Analysis & Insight
Algolux Brings Atlas Camera ISP Optimization for Computer Vision to Arm ISP Users
2021-04-08 10:48:00
SoC Architecture & Assembly
AMD and Xilinx Stockholders Overwhelmingly Approve AMD's Acquisition of Xilinx
2021-04-08 07:33:00
Strategic Partnerships
Intrinsic closes GBP 1.35m seed funding round to prototype next generation memory devices
2021-04-07 23:04:00
Strategic Partnerships
Semiconductor Units Forecast To Exceed 1 Trillion Devices Again in 2021
2021-04-07 14:00:00
Analysis & Insight
ZiFiSense, Socionext and Techsor Complete Development of Next-Generation ZETA Communication Standard
2021-04-07 13:50:00
Misc
Efinix Announces Expansion of High-Performance Titanium FPGA Product Line
2021-04-07 13:41:00
SoC Architecture & Assembly
UMC Reports Sales for March 2021
2021-04-07 13:22:00
Financials
Intel Launches Its Most Advanced Performance Data Center Platform
2021-04-07 01:31:00
SoC Architecture & Assembly
Aragio Solutions Achieves ISO 9001:2015 Certification
2021-04-06 19:16:00
Strategic Partnerships
First Google-Sponsored MPW Shuttle Launched at SkyWater with 40 Open Source Community Submitted Designs
2021-04-06 15:53:00
Foundries & Process Nodes
Synopsys and Samsung Foundry Collaboration Delivers High-Performance Physical Signoff on Samsung SAFE Cloud Design Platform
2021-04-06 15:07:00
EDA & Design Tools
GUC Monthly Sales Report - March 2021
2021-04-06 10:56:00
Financials
Global Semiconductor Sales Up 14.7% Year-to-Year in February
2021-04-06 07:20:00
Analysis & Insight
Siemens introduces PCBflow, a secure, cloud-based solution for accelerating design-to-manufacturing handoff for printed circuit boards
2021-04-06 06:30:00
EDA & Design Tools