CEVA's Bluetooth Dual Mode 5.2 Platform Achieves SIG Qualification, Expedites IC Design for TWS Earbuds and More 2021-05-06 13:03:00 IP Cores & Design
CCSDS 231.0-B-3 LDPC Encoder and Decoder IP Core from Creonic Now Available 2021-05-06 12:22:00 IP Cores & Design
OmniVision Reduces Automotive Camera Design Complexity with the New, High-Performance OAX4000 ASIC Image Signal Processor 2021-05-05 15:27:00 SoC Architecture & Assembly
PsiQuantum and GLOBALFOUNDRIES to Build the World's First Full-scale Quantum Computer 2021-05-05 15:22:00 Foundries & Process Nodes
Synopsys Delivers Enhanced Memory Design Productivity to Nanya Technology 2021-05-05 15:11:00 EDA & Design Tools
Achronix Announces First Quarter 2021 Financial Results and Business Highlights 2021-05-05 07:48:00 Financials
Esperanto Technologies Adopts Movellus Maestro AI, Intelligent Clock Networks for Its ET-SoC-1 Chip 2021-05-04 15:11:00 Commercial Deals
SmartDV Unveils Automation Tool Suite for Use with Its Extensive Verification IP Portfolio 2021-05-04 13:20:00 EDA & Design Tools
MIPI Alliance Releases Specifications to Streamline Integration of In-Vehicle Displays, Add Functional Safety to Display Data Streams 2021-05-04 13:20:00 Misc
Samsung Expected to Recapture #1 Semi Supplier Ranking in 2Q21 2021-05-04 10:12:00 Analysis & Insight
Pixilica Signs Development Agreement with SiliconArts for RayCore GPU Core 2021-05-04 08:30:00 Commercial Deals