Diakopto's ParagonX Platform Selected by The Six Semi for High-Speed Memory PHYs
2021-11-09 06:16:00
EDA
Recent News
Heterogeneous Computing Is About Optimizing Resources
2021-11-08 15:29:00
Commentary / Analysis
Corigine Brings Prototyping And Emulation Acceleration To The Desktop With MimicTurbo GT Card
2021-11-08 15:25:00
Embedded Systems
Bluetooth Dual Mode v5.3 RF Transceiver IP Cores in 40nm ULP is available for immediate licensing for Audio SoC applications.
2021-11-08 08:35:00
Other
GUC Monthly Sales Report - Oct 2021
2021-11-08 08:30:00
Financial
IAR Systems enables early technology adoption of the AI-capable Arm Cortex-M55 core
2021-11-08 08:22:00
Embedded Systems
Mythic Adds Two Silicon Valley Veterans to Its Leadership Team
2021-11-08 08:01:00
People
sureCore-led consortium wins £6.5M Innovate UK grant to develop cryogenic CMOS IP to accelerate Quantum Computing scalability
2021-11-05 09:56:00
Business
Samsung and Alphawave IP Announce Acceleration of Deep Partnership with Flagship Global Hyperscaler Design Win at 4nm
2021-11-04 16:32:00
IP
Blue Cheetah Bunch-of-Wires (BoW) Chiplet Interface Solution Targets Rapid Flexibility, Scalability, and Low Overhead
2021-11-04 16:29:00
IP
Imagination launches the most advanced ray tracing GPU
2021-11-04 16:23:00
IP
Codasip Expands Ecosystem with XtremeEDA
2021-11-04 15:50:00
Business
Kneron Edge AI SoC Powered by Andes RISC-V Processor Core D25F
2021-11-04 15:34:00
Deals
UMC Reports Sales for October 2021
2021-11-04 10:02:00
Financial
Embedded FPGA (eFPGA) technology: Past, present, and future
2021-11-04 08:21:00
Commentary / Analysis
eMemory and UMC Bring New ReRAM Intellectual Property to Market
2021-11-04 08:10:00
IP
Worldwide Silicon Wafer Shipments Reach Record High in Third Quarter of 2021, SEMI Reports
2021-11-04 03:49:00
Commentary / Analysis
Nextchip licenses aiMotive's aiWare4 for their Apache6 automotive domain processor
2021-11-03 16:52:00
Deals
Tessolve Joins GlobalFoundries' Design Enablement Network Program as a Design Partner to Bring Advanced Design Solutions to Accelerate Customer Product Development
2021-11-03 16:49:00
Other
TSMC Recognizes Long-Standing Collaboration with Synopsys on Semiconductor Innovation with Multiple OIP Partner of the Year Awards
2021-11-03 15:20:00
Other
Heterogeneous Computing Is About Optimizing Resources
2021-11-08 15:29:00
Commentary / Analysis
Corigine Brings Prototyping And Emulation Acceleration To The Desktop With MimicTurbo GT Card
2021-11-08 15:25:00
Embedded Systems
Bluetooth Dual Mode v5.3 RF Transceiver IP Cores in 40nm ULP is available for immediate licensing for Audio SoC applications.
2021-11-08 08:35:00
Other
GUC Monthly Sales Report - Oct 2021
2021-11-08 08:30:00
Financial
IAR Systems enables early technology adoption of the AI-capable Arm Cortex-M55 core
2021-11-08 08:22:00
Embedded Systems
Mythic Adds Two Silicon Valley Veterans to Its Leadership Team
2021-11-08 08:01:00
People
sureCore-led consortium wins £6.5M Innovate UK grant to develop cryogenic CMOS IP to accelerate Quantum Computing scalability
2021-11-05 09:56:00
Business
Samsung and Alphawave IP Announce Acceleration of Deep Partnership with Flagship Global Hyperscaler Design Win at 4nm
2021-11-04 16:32:00
IP
Blue Cheetah Bunch-of-Wires (BoW) Chiplet Interface Solution Targets Rapid Flexibility, Scalability, and Low Overhead
2021-11-04 16:29:00
IP
Imagination launches the most advanced ray tracing GPU
2021-11-04 16:23:00
IP
Codasip Expands Ecosystem with XtremeEDA
2021-11-04 15:50:00
Business
Kneron Edge AI SoC Powered by Andes RISC-V Processor Core D25F
2021-11-04 15:34:00
Deals
UMC Reports Sales for October 2021
2021-11-04 10:02:00
Financial
Embedded FPGA (eFPGA) technology: Past, present, and future
2021-11-04 08:21:00
Commentary / Analysis
eMemory and UMC Bring New ReRAM Intellectual Property to Market
2021-11-04 08:10:00
IP
Worldwide Silicon Wafer Shipments Reach Record High in Third Quarter of 2021, SEMI Reports
2021-11-04 03:49:00
Commentary / Analysis
Nextchip licenses aiMotive's aiWare4 for their Apache6 automotive domain processor
2021-11-03 16:52:00
Deals
Tessolve Joins GlobalFoundries' Design Enablement Network Program as a Design Partner to Bring Advanced Design Solutions to Accelerate Customer Product Development
2021-11-03 16:49:00
Other
TSMC Recognizes Long-Standing Collaboration with Synopsys on Semiconductor Innovation with Multiple OIP Partner of the Year Awards
2021-11-03 15:20:00
Other