EU agrees Chips Act terms
2023-04-20 16:46:00
Commentary / Analysis
Recent News
EdgeQ Closes $75M Series-B Investment and Ramps to Customers' Demand for Its Award-Winning 5G+AI Base Station-on-a-Chip for 5G Networks
2023-04-20 16:46:00
Business
Cadence Unleashes the Future of Analog, Custom and RFIC Design with Pioneering AI-Powered Virtuoso Studio
2023-04-20 16:46:00
EDA
TSMC Reports First Quarter EPS of NT$7.98
2023-04-20 16:46:00
Financial
GlobalFoundries Files Lawsuit Against IBM to Protect its Intellectual Property and Trade Secrets
2023-04-20 16:46:00
Legal
EdgeCortix Expands Delivery of its Industry Leading SAKURA-I AI Co-processor Devices and MERA Software Suite
2023-04-20 16:46:00
Chip
Esperanto Technologies Announces RISC-V Industry Milestone Of Generative AI Models Running on ET-SoC-1; Access to be Made Available to the RISC-V Research Community
2023-04-20 13:07:00
Chip
Rambus Accelerates AI Performance with Industry-Leading 24 Gb/s GDDR6 PHY
2023-04-20 09:43:00
IP
The Six Semiconductor of OPENEDGES Receives Best International Business Award from ACCE
2023-04-20 09:20:00
Other
The Need for Security is Everywhere. Intrinsic ID Showcases Expertise and PUF Innovations at Key Industry Events
2023-04-19 15:27:00
Other
Silicon Interfaces enhances Functional Safety ISO 26262-Compliant ASIL C Services Solution for Automotive
2023-04-19 08:19:00
Other
Mixel MIPI C-PHY/D-PHY Combo IP Integrated into Hercules Microelectronics HME-H3 FPGA
2023-04-18 16:01:00
Deals
Rapid Silicon Partners with Elastics.cloud on CXL 3.0 Dual Mode Controller IP to Enhance its Custom FPGA Solutions
2023-04-18 08:51:00
Deals
eMemory's Security-enhanced OTP Qualifies on TSMC N5 Process and Continues to Tackle Automotive Solutions
2023-04-18 08:37:00
IP
Cadence Demonstrates Interoperability with SK hynix's Highest Speed LPDDR5T Mobile DRAM at 9600Mbps
2023-04-18 07:00:00
IP
Cadence Extends Collaboration with TSMC and Microsoft to Advance Giga-Scale Physical Verification in the Cloud
2023-04-17 16:35:00
EDA
TSMC could partner with Bosch for 28nm fab in Germany
2023-04-17 14:57:00
Commentary / Analysis
Arm could be on the hook for $8.5bn of Softbank debt
2023-04-17 14:28:00
Commentary / Analysis
Semidynamics launches world's first fully customisable RISC-V IP cores
2023-04-17 08:54:00
IP
DVB-S2X LDPC/ BCH Encoder and Decoder IP Core Available For Integration From Global IP Core
2023-04-17 07:13:00
IP
EdgeQ Closes $75M Series-B Investment and Ramps to Customers' Demand for Its Award-Winning 5G+AI Base Station-on-a-Chip for 5G Networks
2023-04-20 16:46:00
Business
Cadence Unleashes the Future of Analog, Custom and RFIC Design with Pioneering AI-Powered Virtuoso Studio
2023-04-20 16:46:00
EDA
TSMC Reports First Quarter EPS of NT$7.98
2023-04-20 16:46:00
Financial
GlobalFoundries Files Lawsuit Against IBM to Protect its Intellectual Property and Trade Secrets
2023-04-20 16:46:00
Legal
EdgeCortix Expands Delivery of its Industry Leading SAKURA-I AI Co-processor Devices and MERA Software Suite
2023-04-20 16:46:00
Chip
Esperanto Technologies Announces RISC-V Industry Milestone Of Generative AI Models Running on ET-SoC-1; Access to be Made Available to the RISC-V Research Community
2023-04-20 13:07:00
Chip
Rambus Accelerates AI Performance with Industry-Leading 24 Gb/s GDDR6 PHY
2023-04-20 09:43:00
IP
The Six Semiconductor of OPENEDGES Receives Best International Business Award from ACCE
2023-04-20 09:20:00
Other
The Need for Security is Everywhere. Intrinsic ID Showcases Expertise and PUF Innovations at Key Industry Events
2023-04-19 15:27:00
Other
Silicon Interfaces enhances Functional Safety ISO 26262-Compliant ASIL C Services Solution for Automotive
2023-04-19 08:19:00
Other
Mixel MIPI C-PHY/D-PHY Combo IP Integrated into Hercules Microelectronics HME-H3 FPGA
2023-04-18 16:01:00
Deals
Rapid Silicon Partners with Elastics.cloud on CXL 3.0 Dual Mode Controller IP to Enhance its Custom FPGA Solutions
2023-04-18 08:51:00
Deals
eMemory's Security-enhanced OTP Qualifies on TSMC N5 Process and Continues to Tackle Automotive Solutions
2023-04-18 08:37:00
IP
Cadence Demonstrates Interoperability with SK hynix's Highest Speed LPDDR5T Mobile DRAM at 9600Mbps
2023-04-18 07:00:00
IP
Cadence Extends Collaboration with TSMC and Microsoft to Advance Giga-Scale Physical Verification in the Cloud
2023-04-17 16:35:00
EDA
TSMC could partner with Bosch for 28nm fab in Germany
2023-04-17 14:57:00
Commentary / Analysis
Arm could be on the hook for $8.5bn of Softbank debt
2023-04-17 14:28:00
Commentary / Analysis
Semidynamics launches world's first fully customisable RISC-V IP cores
2023-04-17 08:54:00
IP
DVB-S2X LDPC/ BCH Encoder and Decoder IP Core Available For Integration From Global IP Core
2023-04-17 07:13:00
IP