Semiconductor Equipment Sales Forecast: $37 Billion in 2015 and $38 Billion in 2016
TOKYO, Japan — December 15, 2015 — SEMI projects that worldwide sales of new semiconductor manufacturing equipment will decrease 0.6 percent to $37.3 billion in 2015, according to the SEMI Year-end Forecast, released today at the annual SEMICON Japan exposition. In 2016, nominal positive growth is expected, resulting in a global market increase of 1.4 percent.
The SEMI Year-end Forecast predicts that wafer processing equipment, the largest product segment by dollar value, is anticipated to increase 0.7 percent in 2015 to total $29.5 billion. The “Other Front End” category (fab facilities, mask/reticle, and wafer manufacturing equipment) is expected to increase 20.6 percent in 2015. The forecast predicts that the market for assembly and packaging equipment will decrease by 16.4 percent to $2.6 billion in 2015 and that the market for semiconductor test equipment is forecast to decrease by 7.4 percent, totaling $3.3 billion this year.
For 2015, Taiwan, South Korea, North America, remain the largest spending regions, with investments in Japan approaching North American levels. SEMI forecasts that in 2016, equipment sales in Europe will climb to $3.4 billion (63.1 percent increase over 2015). After a 13 percent contraction for Europe in 2015, GLOBALFOUNDRIES, Infineon, Intel, and STMicroelectronics are all expected to significantly accelerate fab equipment spending in 2016, resulting in strong growth in the region in 2016. In Rest of World, essentially Southeast Asia, sales will reach $2.5 billion (25.7 percent increase), the China market will total $5.3 billion (9.1 percent increase), and North America equipment spending will reach $5.9 billion (6.1 percent increase). The equipment markets in Japan, Korea, and Taiwan are expected to contract in 2016.
The following results are given in terms of market size in billions of U.S. dollars:

The Equipment Market Data Subscription (EMDS) from SEMI provides comprehensive market data for the global semiconductor equipment market. A subscription includes three reports: the monthly SEMI Book-to-Bill Report, which offers an early perspective of the trends in the equipment market; the monthly Worldwide Semiconductor Equipment Market Statistics (SEMS), a detailed report of semiconductor equipment bookings and billings for seven regions and over 22 market segments; and the SEMI Year-end Forecast, which provides an outlook for the semiconductor equipment market. For more information or to subscribe, please contact SEMI customer service at 1.877.746.7788 (toll free in the U.S.) or 1.408.943.6901 (International Callers).
SEMI is the global industry association serving the electronics manufacturing supply chains. Our more than 2,000 member companies are the engine of the future, enabling smarter, faster and more economical products that improve our lives. Since 1970, SEMI has been committed to helping members grow more profitably, create new markets and meet common industry challenges. SEMI maintains offices in Bangalore, Beijing, Berlin, Brussels, Grenoble, Hsinchu, Moscow, San Jose, Seoul, Shanghai, Singapore, Tokyo, and Washington, D.C. For more information, visit www.semi.org.
Related Semiconductor IP
- HBM4 PHY IP
- Ultra-Low-Power LPDDR3/LPDDR2/DDR3L Combo Subsystem
- MIPI D-PHY and FPD-Link (LVDS) Combinational Transmitter for TSMC 22nm ULP
- HBM4 Controller IP
- IPSEC AES-256-GCM (Standalone IPsec)
Related News
- IC Insights Lowers Its 2016 Semiconductor Market Forecast to -1%
- TowerJazz and SMIC's Sales Forecast to Surge in 2016
- 2016 IC Market Forecast Raised from -2% to +1%
- $55.9 Billion Semiconductor Equipment Forecast - New Record with Korea at Top
Latest News
- Weebit Nano secures a license agreement with Texas Instruments
- Digital Blocks DB9000 Display Controller IP Core Family Extends Leadership in 8K, Automotive, Medical, Aerospace, and Industrial SoC Designs
- AI Directs UFS Advancement
- Qualitas Semiconductor Expands Automotive Momentum with 5nm IP Bundle Agreement
- Cyient Semiconductors Acquires Majority Stake in Kinetic Technologies to Drive Custom Power IC Leadership for Edge AI and High-Performance Compute Markets