Omni Design Technologies Advances 200G-Class Co-Packaged Optics IP Portfolio for Next-Generation AI Infrastructure 2026-02-06 15:33:12
Arm delivers fourth consecutive billion-dollar revenue quarter, extending record-breaking momentum 2026-02-05 07:06:19
BrainChip Announces Immediate Availability of Akida™ Pico for Remote Evaluation via FPGA Cloud 2026-02-05 06:30:50
VeriSilicon Enhanced ISP8200-FS Series IP Achieves ASIL B Functional Safety Certification 2026-02-05 04:34:00
PQSecure Collaborates with George Mason University on NIST Lightweight Cryptography Hardware Research 2026-02-06 16:33:34 Research Institutions
Omni Design Technologies Advances 200G-Class Co-Packaged Optics IP Portfolio for Next-Generation AI Infrastructure 2026-02-06 15:33:12 IP Cores & Design
Global Annual Semiconductor Sales Increase 25.6% to $791.7 Billion in 2025 2026-02-06 14:37:36 Financials
Fabless Startup Aheesa Tapes Out First Indian RISC-V Network SoC 2026-02-06 06:34:07 Analysis & Insight
SmartDV and Mirabilis Design Announce Strategic Collaboration for System-Level Modeling of SmartDV IP 2026-02-05 12:53:02 EDA & Design Tools
Arm delivers fourth consecutive billion-dollar revenue quarter, extending record-breaking momentum 2026-02-05 07:06:19 Financials
BrainChip Announces Immediate Availability of Akida™ Pico for Remote Evaluation via FPGA Cloud 2026-02-05 06:30:50 IP Cores & Design
VeriSilicon Enhanced ISP8200-FS Series IP Achieves ASIL B Functional Safety Certification 2026-02-05 04:34:00 IP Cores & Design
Phison Selects Andes RISC-V Cores for its First aiDAPTIV+ AI Solution, Marking a Major Milestone in AI Architecture 2026-02-05 04:16:00 Deals, Partnerships & M&A
Arasan's ultra low power MIPI D-PHY IP achieves ISO26262 Certification 2026-02-04 19:52:46 IP Cores & Design
Positron AI Raises $230 Million Series B at Over $1 Billion Valuation to Scale Energy-Efficient AI Inference 2026-02-04 15:35:56 Financials
EvertzAV Successfully Integrates IntoPIX JPEG XS Temporal Differential Coding Into Its IPMX-Certified NUCLEUS Platform 2026-02-04 12:36:25 IP Cores & Design
SoftBank Corp. Subsidiary SAIMEMORY and Intel Collaborate to Commercialize Next-generation Memory Technology 2026-02-04 08:55:30 Deals, Partnerships & M&A
TES is extending its PMU IP portfolio for X-FAB’s XT018 - 0.18µm BCD-on-SOI technology. 2026-02-04 08:50:00 IP Cores & Design
Attopsemi Scales I-fuse® Technology to 7nm FinFET following 12nm Silicon Success 2026-02-04 08:14:00 IP Cores & Design