Transceiver IP

The Wi-Fi 7 (802.11be) RF transceiver IP, operating in 2.4GHz / 5GHz / 6GHz bands, is tailored for next-generation high-performance applications.
This tri-band system delivers exceptional wireless communication capabilities with support for Wi-Fi 6/6E/n/g/b/a, enabling seamless connectivity across a wide frequency spectrum (5.925–7.125 GHz).
With support for advanced 4096-QAM modulation, the IP is capable of ultra-high data throughput, making it an ideal solution for bandwidth-intensive applications requiring low latency, fast data rates, and robust connectivity.

The M-PHYs are of Type 1, which apply to UFS, LLI and CSI-3 protocols.
The Multi-gear M-PHY 3.0 consists of analog transceivers, high speed PLL, data recovery units as well as the state-machine control — all in a single GDSII.
The interface to the link protocol-specific controller (host or device) is compliant to the M-PHY RMMI specification, which allows seamless integration of the two IPs, namely the controller and the PHY, into the chip design.

The MIPI D-PHY Analog Transceiver IP Core is fully compliant with the D-PHY specification version 1.1.
It supports the MIPI® Camera Serial Interface (CSI-2) and Display Serial Interface (DSI) protocols at speeds up to 1.5Gbps per lane.
It is a Universal PHY that can be configured as a transmitter, receiver, or transceiver.

The M-PHY is of Type 1, which apply to UFS, LLI, and CSI-3 protocols. The Multi-gear M-PHY 4.1 consists of analog transceivers, high-speed PLL, data recovery units as well as state-machine control — all in a single GDSII.
The interface to the link protocol-specific controller (host or device) is compliant with the M-PHY RMMI specification, which allows seamless integration of the two IPs, namely the controller and the PHY, into the chip design.

This 1.8V LVDS transceiver, designed for TSMCs 28nm process, delivers high-speed, low-power differential signaling with superior signal integrity.
Engineered with 1.8V thick oxide devices and a 0.8V standard core interface, it operates ef- ficiently across a wide temperature range (-40°C to 125°C).

This 1.8V SLVS transceiver is a high-performance, low-power I/O solution optimized for TSMCs 28nm process.
Designed with 1.8V thick oxide devices and a standard low-voltage core interface at 0.8V, this transceiver ensures robust operation across a wide temperature range (-40°C to 125°C).
Supporting high-speed differential signaling up to 2Gbps, it delivers ex- ceptional signal integrity with low jitter and precise eye diagrams.

The 2.5Gbps LVDS transceiver in GlobalFoundries LP/LP+ is designed for high-speed, low-power data transmission in radiation-intensive environments.
Engineered with a Rad-Hard by Design approach, the Rad-Hard cells have been proton tested to 64 MeV with a flux exceeding 1.3E+09, and is latch-up proven to 200mA across -40C to 125C, ensuring robust immunity against TID, SEE, and SEL effects.

This SLVS I/O Library delivers a robust, high-performance solution for high-speed differential signaling in GlobalFoundries 12nm process technology.
Designed for optimal signal integrity, this 0.8V SLVS transceiver features fast rise and fall times, low propagation delay, and built-in pre-emphasis to enhance signal quality over longer traces.
With support for data rates up to 3Gbps, it enables reliable, low-power communication while maintaining excellent noise immunity.

AD_SLVS_LVDS is a highly conﬁgurable 2Gbps transceiver for LVDS or SLVS interfaces. With features like dynamic interface selection, on-die termination and pre-emphasis, this I/O is ﬂexible enough for any system.
To compliment this I/O, the vendor also offers a accompanying silicon-proven ESD and GPIO pad library in TSMC 12/16nm.
This I/O provides 2kV HBM protection but can be extended up to 8kV upon request.