IP Catalog > USB 3.0 Type-C PHY

USB 3.0 Type-C PHY IP

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Compare 49 IP from 5 vendors (1 - 10)
  • SMIC 28nm USB3.0 Dual Role PHY/Type-C
    • 5-Gbps SuperSpeed data transmission rate through 3-m USB3.0 cable
  • USB 3.0 SSPHY in GF (22nm)
    • Complete mixed-signal physical layer for USB 3.0 applications
    • Includes all circuitry needed for operation at all USB speeds (SuperSpeed, High-Speed, FullSpeed, Low-Speed)
    • USB-C 3.0 femtoPHY supports Type-C reversible connectors
    • Optimized PHY area (<0.5mm2 for USB 3.0, <0.8mm2 for USB-C 3.0)
  • USB 3.0 PHY in UMC (65nm, 40nm)
    • Complete mixed-signal physical layer for USB 3.0 applications
    • Includes all circuitry needed for operation at all USB speeds (SuperSpeed, High-Speed, FullSpeed, Low-Speed)
    • USB-C 3.0 femtoPHY supports Type-C reversible connectors
    • Optimized PHY area (<0.5mm2 for USB 3.0, <0.8mm2 for USB-C 3.0)
  • USB 3.0 PHY in TSMC (65nm, 55nm, 40nm, 28nm)
    • Complete mixed-signal physical layer for USB 3.0 applications
    • Includes all circuitry needed for operation at all USB speeds (SuperSpeed, High-Speed, FullSpeed, Low-Speed)
    • USB-C 3.0 femtoPHY supports Type-C reversible connectors
    • Optimized PHY area (<0.5mm2 for USB 3.0, <0.8mm2 for USB-C 3.0)
  • USB 3.0 PHY in Samsung (28nm, 14nm)
    • Complete mixed-signal physical layer for USB 3.0 applications
    • Includes all circuitry needed for operation at all USB speeds (SuperSpeed, High-Speed, FullSpeed, Low-Speed)
    • USB-C 3.0 femtoPHY supports Type-C reversible connectors
    • Optimized PHY area (<0.5mm2 for USB 3.0, <0.8mm2 for USB-C 3.0)
  • USB 3.0 PHY in SMIC (110nm, 65nm, 40nm)
    • Complete mixed-signal physical layer for USB 3.0 applications
    • Includes all circuitry needed for operation at all USB speeds (SuperSpeed, High-Speed, FullSpeed, Low-Speed)
    • USB-C 3.0 femtoPHY supports Type-C reversible connectors
    • Optimized PHY area (<0.5mm2 for USB 3.0, <0.8mm2 for USB-C 3.0)
  • USB 3.0 PHY in GF (65nm, 55nm, 40nm, 28nm)
    • Complete mixed-signal physical layer for USB 3.0 applications
    • Includes all circuitry needed for operation at all USB speeds (SuperSpeed, High-Speed, FullSpeed, Low-Speed)
    • USB-C 3.0 femtoPHY supports Type-C reversible connectors
    • Optimized PHY area (<0.5mm2 for USB 3.0, <0.8mm2 for USB-C 3.0)
  • USB-C 3.0 femtoPHY in Type-C in TSMC (28nm, 16nm, 12nm)
    • Complete mixed-signal physical layer for USB 3.0 applications
    • Includes all circuitry needed for operation at all USB speeds (SuperSpeed, High-Speed, FullSpeed, Low-Speed)
    • USB-C 3.0 femtoPHY supports Type-C reversible connectors
    • Optimized PHY area (<0.5mm2 for USB 3.0, <0.8mm2 for USB-C 3.0)
  • USB 3.0 femtoPHY in UMC (28nm, 12nm)
    • Complete mixed-signal physical layer for USB 3.0 applications
    • Includes all circuitry needed for operation at all USB speeds (SuperSpeed, High-Speed, FullSpeed, Low-Speed)
    • USB-C 3.0 femtoPHY supports Type-C reversible connectors
    • Optimized PHY area (<0.5mm2 for USB 3.0, <0.8mm2 for USB-C 3.0)
  • USB 3.0 femtoPHY in TSMC (28nm, 22nm, 16nm, 12nm)
    • Complete mixed-signal physical layer for USB 3.0 applications
    • Includes all circuitry needed for operation at all USB speeds (SuperSpeed, High-Speed, FullSpeed, Low-Speed)
    • USB-C 3.0 femtoPHY supports Type-C reversible connectors
    • Optimized PHY area (<0.5mm2 for USB 3.0, <0.8mm2 for USB-C 3.0)
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