ONFI 4.0 NAND Flash IP
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16
IP
from 5 vendors
(1
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10)
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ONFI 4.0 NAND Flash Controller & PHY
- • Support ONFI 4.0, EZ – NAND, Standard ClearNAND, Advanced ClearNAND
- • Support standard asynchronous NAND flash
- • High performance from 40MT/s to 800MT/s
- • High density NAND flash up to 1024 Gb
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NAND Flash Memory Controller with DMA
- ONFI 4.0 support
- BCH EDAC with up to 60 bits correction capacity per 1024 bytes chunks of data
- Randomization of memory data
- Basic timeout based SEFI detection and reporting
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ONFI 4.1 NAND Flash Controller & PHY & IO Pads on 16nm
- Page Size – 2KB, 4KB, 8KB, 16KB
- Bank/chip select options
- Programmable timing
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ONFI 4.1 NAND Flash Controller & PHY & IO Pads on 28nm
- Page Size – 2KB, 4KB, 8KB, 16KB
- Bank/chip select options
- Programmable timing
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ONFI 4.1 NAND Flash Controller & PHY & IO Pads on 12nm
- Page Size – 2KB, 4KB, 8KB, 16KB
- Bank/chip select options
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ONFi PHY 4.0 (FPHY+MDLL+SDLL Regulator) (Silicon Proven in TSMC 28HPC+)
- Support ONFi 4.0 IO Electrical Specification
- Support Legacy up to 50MHz
- Support NV-DDR2 with operating frequency up to 533Mbps
- Support NV-DDR3 with operating frequency up to 800Mbps
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ONFI 4.1 PHY IP (Silicon Proven in TSMC 12FFC)
- Support ONFi 4.1 IO Electrical Specification
- Support Legacy up to 50MHz
- Support NV-DDR2 up to 533Mbps
- Support NV-DDR3 up to 1200Mbps
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Advanced Flash Controller Interface Core
- Multi-Port Architecture allows connecting up to 32 NAND devices (128 total NAND targets)
- Separate Administrative and I/O queues for flexible datapath management
- Maximum of 1 register write per command submission/ completion
- Industry standard bus interface (AXI-4) master used for command fetching, command completion, and data movement
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Supporting ONFI 6.0, 5.0, 4.2, 4.1, 4.0 and ONFI 3
- Supporting ONFI 6, 5, 4 and ONFI 3
- Pad design with 25um pitch
- Supports wirebond/CUP and flipchip packages
- Programmable metal stack options
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Supporting ONFI 5.0, 4.2, 4.1, 4.0 and ONFI 3
- Supporting ONFI 5, 4 and ONFI 3
- Pad design with 25um pitch
- Supports wirebond/CUP and flipchip packages
- Programmable metal stack options