2.5D GPU IP

Filter
Filter

Login required.

Sign in

Login required.

Sign in

Compare 10 IP from 4 vendors (1 - 10)
  • Vector Graphics IP
    • Display Resolution: Up to 4K
    • ROPS (Pixels Per Cycle) : 1
    • API Support:Vector Graphics VGLite API
    • Embedded Linux Support
  • Vector Graphics IP
    • Hardware off-load compatiable with virtually all CPU types
    • Ultra-compact driver footprint enables DDR-less operation with onboard SRAM
  • HBM3 PHY IP at 7nm
    • Unbeatable performance-driven and low-power-driven PPA
    • Ultra-low read/write latency with programmable PHY boundary timing
    Block Diagram -- HBM3 PHY IP at 7nm
  • TSMC N3P Source Sync 3DIO PHY
    • Optimized for heterogeneous integration in 3D stacking
    • Enabling designers the flexibility and scalability to accelerate multi-die integration
    • Optimal PPA architected to supporting 2.5D and 3D packages
    • Versatile offering tuned for optimal use scenarios, including:
  • TSMC N3P Source Sync 3DIO Library
    • Optimized for heterogeneous integration in 3D stacking
    • Enabling designers the flexibility and scalability to accelerate multi-die integration
    • Optimal PPA architected to supporting 2.5D and 3D packages
    • Versatile offering tuned for optimal use scenarios, including:
  • TSMC N3P 3DIO Library
    • Optimized for heterogeneous integration in 3D stacking
    • Enabling designers the flexibility and scalability to accelerate multi-die integration
    • Optimal PPA architected to supporting 2.5D and 3D packages
    • Versatile offering tuned for optimal use scenarios, including:
  • TSMC N5 Source Sync 3DIO Library
    • Optimized for heterogeneous integration in 3D stacking
    • Enabling designers the flexibility and scalability to accelerate multi-die integration
    • Optimal PPA architected to supporting 2.5D and 3D packages
    • Versatile offering tuned for optimal use scenarios, including:
  • Synopsys Synthesizable 3DIO IP for Flexible Physical Implementation
    • Optimized for heterogeneous integration in 3D stacking
    • Enabling designers the flexibility and scalability to accelerate multi-die integration
    • Optimal PPA architected to supporting 2.5D and 3D packages
    • Versatile offering tuned for optimal use scenarios, including:
  • 3DIO PHY IP for TSMC N5
    • Optimized for heterogeneous integration in 3D stacking
    • TSMC N5
  • 2.5D Multi-Core Raster & Vector Graphics Processor for low-power SoCs with Microcontroller
    • Programmable Shader engine with a VLIW instruction set
    • Command list based DMAs to minimize CPU overhead
    • Primitive Rasterizer
    Block Diagram -- 2.5D Multi-Core Raster & Vector Graphics Processor for low-power SoCs with Microcontroller
×
Semiconductor IP