USB 2.0 PHY - SMIC 55nm Eflash

Key Features

• HBM:8KV
• Low cost; low size 0.175mm^2 in 65nm process(including 7 PADs), and 0.142mm^2 in 55nm process(including 7 PADs)

Benefits

• Cost saving compared to eflash technology

Deliverables

• Technical documents,GDS hard macro to foundry for IP merge

Technical Specifications