Lightweight die-to-die interconnect solution consisting of the Physical Layer, Die-to-Die Layer and Protocol Layer optimized for highest performance with the lowest power and area overhead that is compliant to the Universal Chiplet Interconnect Express (UCIe) 2.0 specification.
UCIe PHY & Controller
Overview
Key Features
- Supports transfer rates of up to 32 Gbps/pin for up to 8Tbps with 10.5Tbps/mm of die edge bandwidth
- Supports PCIe, CXL and streaming protocols adaptable to any communication protocols including extending the vendor's Non-Coherent and Coherent NOC interconnects across multiple dies
- Built-in link initialization
- Supports major 2.5D inter-die packaging technologies and standard packaging technologies
- Supports internal and external (PHY-to-PHY) loopback test
- Supports built-in self-test and repair functionality to maximize post-package yield
Technical Specifications
Short description
UCIe PHY & Controller
Vendor
Vendor Name