Low-cap high-speed RF analog IO

Key Features

  • Low-cap. high-speed RF analog IO, support >2GHz signal
  • Cell Size (Width * height) 60um * 126um with DUP in-line bonding pads
  • Work voltage: 1.1V/1.8V~3.3V power
  • SMIC 0.040um Logic Salicide 1.1V/2.5V low leakage Process
  • Suitable for 7, 8 and 9 layers application (single top metal, thick top matal)
  • Suitable for 7, 8, 9 and 10 layers application (double top metal, thick top matel)

Technical Specifications

Foundry, Node
SMIC 40nm
Maturity
Silicon Proven
SMIC
Pre-Silicon: 40nm LL
×
Semiconductor IP