Distributed Thermal Sensor (DTS) Deep NWELL, TSMC N3

The highly granular DTS offers a significant area reduction in comparison to some standard in-chip thermal sensor solutions and supports high accuracy measurement across a wide temperature range at enhanced conversion speeds. Thermal activity can be unpredictable and if not monitored carefully can cause over-heating and excessive power consumption which in turn impacts device longevity. The ability to make precise thermal measurements beside or within CPU cores, high speed interfaces or highly active circuitry has become a mandatory requirement for devices used within a range of application areas. This In-Chip Sensing and PVT Monitoring IP is available as part of the Synopsys DesignWare® Foundation IP portfolio. It also forms the foundation of the new Synopsys Silicon Lifecycle Management (SLM) platform. SLM enables new levels of insight for both SoC providers as well as their customers to optimize operational activities at each stage of the device and system lifecycles from design to in-field.