Die-to-Die, 112G Ultra-Extra Short Reach PHY Ported to TSMC 12FFC X8, North/South (vertical) poly orientation

The XSR PHY IP for 112Gbps per lane die-to-die connectivity enables high-bandwidth ultra and extra short reach interfaces in multi-chip modules (MCMs) for hyperscale data center, AI, and networking applications. The low-latency, low-power, and compact PHY supports NRZ and PAM-4 signaling from 2.5G to 112G data rates and is compliant with the OIF CEI-112G and CEI-56G standards for extra-short reach (XSR) links. The XSR PHY offers a flexible layout for maximum bandwidth per die edge by allowing the placement of the square macros along all edges of the die. It deploys 16-lane transmit and receive macros for optimized segmentation on the multiple dies. The robust DLL-based clock-forwarded architecture enables high energy efficiency while supporting reliable links of up to 50 millimeters for large MCMs. The PHY enables multi-die connectivity over organic substrates, which helps reduce packaging costs without requiring advanced interposer-based packaging over shorter distances. The embedded bit error rate (BER) tester and nondestructive 2D eye monitor capability provide on-chip testability and visibility into channel performance. Besides the PMA and PMD, the PHY includes a raw PCS to facilitate the interface with the on-chip network, regardless of the existing networking protocol. The XSR IP is combined with the comprehensive routing feasibility analysis, package substrate guidelines, signal and power integrity models, and crosstalk analysis for fast and reliable integration into SoCs.