Command/Address Block of DDR3/DDR4/LPDDR2/LPDDR3 Combo PHY supporting 2-rank application for Copper Pillar Bump Flip Chip Version; UMC 40nm LP LVT/RVT LowK Logic Process
Overview
Command/Address Block of DDR3/DDR4/LPDDR2/LPDDR3 Combo PHY supporting 2-rank application for Copper Pillar Bump Flip Chip Version; UMC 40nm LP LVT/RVT LowK Logic Process
Technical Specifications
Foundry, Node
UMC 40nm Logic/Mixed_Mode LP
UMC
Pre-Silicon:
40nm
,
40nm
LP
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