Teardown of Verizon’s Apple iPhone reveals chips used
February 11, 2011
One of the most anticipated product rollouts of the year is already happening this week—the Verizon CDMA version of the Apple iPhone—and two organizations have already done us the great favor of tearing a sample phone apart and enumerating the significant chips found inside. The two organizations are UBM TechInsights (affiliated with EE Times) and ifixit.com. And you know what? They seem to have torn apart slightly different versions.
Related Semiconductor IP
- Network-on-Chip (NoC)
- 12-bit, 400 MSPS SAR ADC - TSMC 12nm FFC
- DVB-S2 Demodulator
- UCIe PHY (Die-to-Die) IP
- UCIe-S 64GT/s PHY IP
Related Blogs
- Where will Apple Manufacture the next iPhone Brain?
- Apple iPhone 6S: LPDDR4 arrives at Apple
- Who Will Get the Next Bite of Apple Chip Business?
- From IBM Mainframes to Wintel PCs to Apple iPhones: 70% is the Magic Number
Latest Blogs
- Enabling End-to-End EDA Flow on Arm-Based Compute for Infrastructure Flexibility
- Real PPA improvements from analog IC migration
- Design specification: The cornerstone of an ASIC collaboration
- The importance of ADCs in low-power electrocardiography ASICs
- VESA Adaptive-Sync V2 Operation in DisplayPort VIP