TSMC "actively" mulling US fab
TSMC is “actively” considering building its 2nm fab in the US, reports the Nikkei.
“TSMC is facing a strategic decision of whether it wants to later focus more on the U.S. market or the Chinese market,” Su Tze-Yun, director of Taiwan’s Institute for National Defense and Security Research, told the Nikkei, “building an advanced chip plant could be one solution.”
To read the full article, click here
Related Semiconductor IP
- Root of Trust (RoT)
- Fixed Point Doppler Channel IP core
- Multi-protocol wireless plaform integrating Bluetooth Dual Mode, IEEE 802.15.4 (for Thread, Zigbee and Matter)
- Polyphase Video Scaler
- Compact, low-power, 8bit ADC on GF 22nm FDX
Related Blogs
- US pressures TSMC not to fab Huawei ICs
- Should The US Government Invest In Fab?
- TSMC Ponders One-Customer Fabs
- Disable TSMC Fabs If China Invades
Latest Blogs
- FiRa 3.0 Use Cases: Expanding the Future of UWB Technology
- Cadence Announces Industry's First Verification IP for Embedded USB2v2 (eUSB2v2)
- The Industry’s First USB4 Device IP Certification Will Speed Innovation and Edge AI Enablement
- Understanding Extended Metadata in CXL 3.1: What It Means for Your Systems
- 2025 Outlook with Mahesh Tirupattur of Analog Bits