TSMC Responds to Intel's 14nm Density Claim!
January 22, 2014
TSMC responded to Intel’s 14nm density advantage claim in the most recent conference call. It is something I have been following closely and have written about extensively both publicly and privately. Please remember that the fabless semiconductor ecosystem is all about crowd sourcing and it is very hard to fool a crowd of semiconductor professionals, absolutely. To see Intel's infamous density presentation click HERE.
First let’s take a look at what TSMC had to say:
To read the full article, click here
Related Semiconductor IP
- Bluetooth Low Energy 6.0 Digital IP
- Ultra-low power high dynamic range image sensor
- Flash Memory LDPC Decoder IP Core
- SLM Signal Integrity Monitor
- Digital PUF IP
Related Blogs
- Intel Versus TSMC 14nm Processes
- The Apple Samsung TSMC Intel 14nm Mashup!
- TSMC (Lincoln) vs Samsung (Clinton) vs Intel (Washington)
- Altera, Intel, TSMC, ARM: the Plot Thickens
Latest Blogs
- SiFive Celebrates 10 Years as Your Trusted Partner for RISC-V IP Innovation
- MIPI: Powering the Future of Connected Devices
- ESD Protection for an High Voltage Tolerant Driver Circuit in 4nm FinFET Technology
- Designing the AI Factories: Unlocking Innovation with Intelligent IP
- Smarter SoC Design for Agile Teams and Tight Deadlines