Cadence at CES 2015: The IP Story
LAS VEGAS—The annual International Consumer Electronics Show (CES) here is not just about amazing new technologies, although that's what captures the public's attention. It's about the electronics design ecosystem that enables those products.
The Cadence meeting suite may traditionally be tucked away from the crowds near the back of South Hall 2, but it's no less a hive of activity involving members of the IP Group and partners and customers.
Martin Lund, senior vice president for Cadence's IP Group, took some time to talk during CES about what he saw on the show floor and in the bustling Cadence booth, where, he argued, some of the more amazing demos could be seen:
Related Semiconductor IP
- HBM4 PHY IP
- eFuse Controller IP
- Secure Storage Solution for OTP IP
- Ultra-Low-Power LPDDR3/LPDDR2/DDR3L Combo Subsystem
- MIPI D-PHY and FPD-Link (LVDS) Combinational Transmitter for TSMC 22nm ULP
Related Blogs
- Cadence Unveils the Industry’s First eUSB2V2 IP Solutions
- Designing the AI Factories: Unlocking Innovation with Intelligent IP
- The Next-Generation UCIe IP Subsystem for Advanced Package Designs
- Cadence at CES 2015: Experience Integrated Solutions for Mobile