Cadence at CES 2015: The IP Story
January 12, 2015
LAS VEGAS—The annual International Consumer Electronics Show (CES) here is not just about amazing new technologies, although that's what captures the public's attention. It's about the electronics design ecosystem that enables those products.
The Cadence meeting suite may traditionally be tucked away from the crowds near the back of South Hall 2, but it's no less a hive of activity involving members of the IP Group and partners and customers.
Martin Lund, senior vice president for Cadence's IP Group, took some time to talk during CES about what he saw on the show floor and in the bustling Cadence booth, where, he argued, some of the more amazing demos could be seen:
Related Semiconductor IP
- NFC wireless interface supporting ISO14443 A and B with EEPROM on SMIC 180nm
- DDR5 MRDIMM PHY and Controller
- RVA23, Multi-cluster, Hypervisor and Android
- HBM4E PHY and controller
- LZ4/Snappy Data Compressor
Related Blogs
- DDR5 12.8Gbps MRDIMM IP: Powering the Future of AI, HPC, and Data Centers
- Advancing Die-to-Die Connectivity: The Next-Generation UCIe IP Subsystem
- Cadence Unveils the Industry’s First eUSB2V2 IP Solutions
- Cadence at CES 2015: Experience Integrated Solutions for Mobile
Latest Blogs
- lowRISC Tackles Post-Quantum Cryptography Challenges through Research Collaborations
- How to Solve the Size, Weight, Power and Cooling Challenge in Radar & Radio Frequency Modulation Classification
- Programmable Hardware Delivers 10,000X Improvement in Verification Speed over Software for Forward Error Correction
- The Integrated Design Challenge: Developing Chip, Software, and System in Unison
- Introducing Mi-V RV32 v4.0 Soft Processor: Enhanced RISC-V Power