Mobile World Congress: A Decade of Change in IP Innovation
BARCELONA, Spain—In the past decade, immense change has come to mobile electronic system design. Steve Roddy should know. He’s had a ringside seat to those changes—and Mobile World Congress—for years.
Roddy, senior group director for Tensilica marketing, said during MWC 2015 that system design is a much different challenge than it was a decade ago. (Tensilica, which Cadence acquired in 2013, has exhibited at big events like MWC and Consumer Electronics Show for years).
To read the full article, click here
Related Semiconductor IP
- HBM4 PHY IP
- Ultra-Low-Power LPDDR3/LPDDR2/DDR3L Combo Subsystem
- MIPI D-PHY and FPD-Link (LVDS) Combinational Transmitter for TSMC 22nm ULP
- HBM4 Controller IP
- IPSEC AES-256-GCM (Standalone IPsec)
Related Blogs
- Andes Technology: A RISC-V Powerhouse Driving Innovation in CPU IP
- Utilizing CXL 2.0 IP in the Defense Sector: A Revolution in Secure Computing
- World IP Day: A Time to Reflect on the Value of Semiconductor IP
- SiFive; Empowering A New Era of Data Center Innovation
Latest Blogs
- ReRAM in Automotive SoCs: When Every Nanosecond Counts
- AndeSentry – Andes’ Security Platform
- Formally verifying AVX2 rejection sampling for ML-KEM
- Integrating PQC into StrongSwan: ML-KEM integration for IPsec/IKEv2
- Breaking the Bandwidth Barrier: Enabling Celestial AI’s Photonic Fabric™ with Custom ESD IP on TSMC’s 5nm Platform