Mobile World Congress: A Decade of Change in IP Innovation
BARCELONA, Spain—In the past decade, immense change has come to mobile electronic system design. Steve Roddy should know. He’s had a ringside seat to those changes—and Mobile World Congress—for years.
Roddy, senior group director for Tensilica marketing, said during MWC 2015 that system design is a much different challenge than it was a decade ago. (Tensilica, which Cadence acquired in 2013, has exhibited at big events like MWC and Consumer Electronics Show for years).
To read the full article, click here
Related Semiconductor IP
- MIPI SoundWire I3S Peripheral IP
- MIPI SoundWire I3S Manager IP
- eDP 2.0 Verification IP
- Gen#2 of 64-bit RISC-V core with out-of-order pipeline based complex
- LLM AI IP Core
Related Blogs
- Andes Technology: A RISC-V Powerhouse Driving Innovation in CPU IP
- Utilizing CXL 2.0 IP in the Defense Sector: A Revolution in Secure Computing
- World IP Day: A Time to Reflect on the Value of Semiconductor IP
- SiFive; Empowering A New Era of Data Center Innovation
Latest Blogs
- ML-KEM explained: Quantum-safe Key Exchange for secure embedded Hardware
- Rivos Collaborates to Complete Secure Provisioning of Integrated OpenTitan Root of Trust During SoC Production
- From GPUs to Memory Pools: Why AI Needs Compute Express Link (CXL)
- Verification of UALink (UAL) and Ultra Ethernet (UEC) Protocols for Scalable HPC/AI Networks using Synopsys VIP
- Enhancing PCIe6.0 Performance: Flit Sequence Numbers and Selective NAK Explained