450mm Semiconductor Manufacturing Debate
May 24, 2010
TSMC, Intel, Toshiba, and Samsung all support the transition to 450mm citing both important technological advancements as well as significant capacity increases to meet the needs of future smartphone users around the world. One 450mm wafer should yield more than twice as much compared to today’s 300mm, and well over four times the number from yesterday’s 200mm.
Related Semiconductor IP
- MIPI SoundWire I3S Peripheral IP
- Post-Quantum ML-KEM IP Core
- MIPI SoundWire I3S Manager IP
- eDP 2.0 Verification IP
- Gen#2 of 64-bit RISC-V core with out-of-order pipeline based complex
Related Blogs
- Reshoring Semiconductor Manufacturing
- Smart Manufacturing Makes Semiconductor Fabrication and Advanced Electronics Possible
- Introducing Fab.da: A Comprehensive, AI-Powered Solution for Efficient Semiconductor Manufacturing
- Is 450mm A Dead Duck?
Latest Blogs
- ML-KEM explained: Quantum-safe Key Exchange for secure embedded Hardware
- Rivos Collaborates to Complete Secure Provisioning of Integrated OpenTitan Root of Trust During SoC Production
- From GPUs to Memory Pools: Why AI Needs Compute Express Link (CXL)
- Verification of UALink (UAL) and Ultra Ethernet (UEC) Protocols for Scalable HPC/AI Networks using Synopsys VIP
- Enhancing PCIe6.0 Performance: Flit Sequence Numbers and Selective NAK Explained