450mm Semiconductor Manufacturing Debate
May 24, 2010
TSMC, Intel, Toshiba, and Samsung all support the transition to 450mm citing both important technological advancements as well as significant capacity increases to meet the needs of future smartphone users around the world. One 450mm wafer should yield more than twice as much compared to today’s 300mm, and well over four times the number from yesterday’s 200mm.
Related Semiconductor IP
- 1.8V/3.3V I/O library with ODIO and 5V HPD in TSMC 16nm
- 1.8V/3.3V I/O Library with ODIO and 5V HPD in TSMC 12nm
- 1.8V to 5V GPIO, 1.8V to 5V Analog in TSMC 180nm BCD
- 1.8V/3.3V GPIO Library with HDMI, Aanlog & LVDS Cells in TSMC 22nm
- Specialed 20V Analog I/O in TSMC 55nm
Related Blogs
- Reshoring Semiconductor Manufacturing
- Smart Manufacturing Makes Semiconductor Fabrication and Advanced Electronics Possible
- Introducing Fab.da: A Comprehensive, AI-Powered Solution for Efficient Semiconductor Manufacturing
- Is 450mm A Dead Duck?
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