450mm Semiconductor Manufacturing Debate
TSMC, Intel, Toshiba, and Samsung all support the transition to 450mm citing both important technological advancements as well as significant capacity increases to meet the needs of future smartphone users around the world. One 450mm wafer should yield more than twice as much compared to today’s 300mm, and well over four times the number from yesterday’s 200mm.
Related Semiconductor IP
- JESD204E Controller IP
- eUSB2V2.0 Controller + PHY IP
- I/O Library with LVDS in SkyWater 90nm
- 50G PON LDPC Encoder/Decoder
- UALink Controller
Related Blogs
- Reshoring Semiconductor Manufacturing
- Smart Manufacturing Makes Semiconductor Fabrication and Advanced Electronics Possible
- Introducing Fab.da: A Comprehensive, AI-Powered Solution for Efficient Semiconductor Manufacturing
- Is 450mm A Dead Duck?
Latest Blogs
- CES 2026 Recap: Trust Built on a Real, Working eUSB2V2 System Demo
- Silicon as strategy: the hidden battleground of the new space race
- Scale-Up and Scale-Out IP for Optical Interconnect for Accelerated Computing
- A Low-Leakage Digital Foundation for SkyWater 90nm SoCs: Introducing Certus’ Standard Cell Library
- FPGAs vs. eFPGAs: Understanding the Key Differences