台积电推出N5A, 赋予汽车高性能计算能力
By Brian Santo, EETimes (June 2, 2021)
Among the new process nodes introduced by Taiwan Semiconductor Manufacturing Co. at its 2021 Virtual Technology Symposium was N5A, which the company said is “aimed at satisfying the growing demand for computing power in newer and more intensive automotive applications such as AI-enabled driver assistance and the digitization of vehicle cockpits.”
In a blog post, TSMC head of global marketing Godfrey Cheng, wrote that, “Compared to TSMC’s N7 technology with the Automotive Service Package, N5A delivers a ~20% improvement in performance or a ~40% improvement in power efficiency and a ~80% improvement in logic density.”
What most people skimmed over about those first few amazing autonomous vehicles (AV) is that they all had the rough equivalent of a small data center in the trunk. Ever since, auto companies and their suppliers have been trying to figure out a practical amount of computing power sufficient to support autonomous driving — and that amount has been significantly less than a small data center. But what if, 10 years after those first AVs were demonstrated, putting a supercomputer in a car has actually become practical — or is close enough to consider it?
To read the full article, click here
Related Semiconductor IP
- USB 4.0 V2 PHY - 4TX/2RX, TSMC N3P , North/South Poly Orientation
- TSMC CLN5FF GUCIe LP Die-to-Die PHY
- Flipchip 1.8V/3.3V I/O Library with ESD-hardened GPIOs in TSMC 12nm FFC/FFC+
- TSMC CLN3FFP HBM4 PHY
- Wi-Fi 7(be) RF Transceiver IP in TSMC 22nm
Related News
- 新思科技获台积公司N3E和N4P工艺认证,推动下一代移动和HPC芯片创新
- 新思科技EDA和IP完整解决方案获台积公司N3E工艺认证,加速HPC、AI、和移动领域设计
- 力旺安全強化型OTP進攻台積進階製程,已完成N5製程驗證並續攻車用解決方案
- NXP和台积电联手打造业界首款支持汽车领域16 纳米 FinFET工艺技术的嵌入式 MRAM