Single port SRAM IP
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289
IP
from 22 vendors
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10)
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Bulk 40ULP Single Port SRAM with low power retention mode, high speed pins on 1 side
- Ultra low power data retention. Memory instances generated by the Bulk 40 ULPgo into a deep sleep mode that retains data at minimal power consumption.
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Bulk 40ULP single port SRAM Compiler - ultra low power, low power retention mode
- Uses low leakage devices and source biasing to minimize standby currents.
- Dedicated standy mode with built in source biasing for the memory array.
- Periphery and array supplies are isolated to allow power off of the perphery when in standy mode.
- .8V supply voltage
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Single Port SRAM with low power retention mode, high speed pins on 1 side
- Ultra low power data retention. Memory instances generated by the Bulk 22ULL go into a deep sleep mode that retains data at minimal power consumption.
- Self biasing. The SP SRAM 22ULL internal self-biasing capabilities provide ease of IP integration.
- High yield. To ensure high manufacturing yield, bulk 22ULL uses low leakage 6T (0.110µ2) bit cells and is consistent with Design for Manufacturing (DFM) guidelines for the Bulk 22ULL process.
- High usability. All signal and power pins are available on metal 4 while maintaining routing porosity in metal 4. Power pins can optionally be made available on metal 5 to simplify the power connections at the chip level.
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Single port SRAM Compiler - low power retention mode
- Uses low leakage devices and source biasing to minimize standby currents.
- Dedicated standy mode with built in source biasing for the memory array.
- Periphery and array supplies are isolated to allow power off of the perphery when in standy mode.
- .8V supply voltage
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TSMC CLN5FF High Density Single Port SRAM Compiler
- The High Density Single Port SRAM operates within voltage range from 0.675 V to 0.825 V and junction temperature range from -40 °C to 125 °C. The available supported macro size is configurable from 512 bits to 576K bits. The Compiler is divided into 1 groups according to their column selection numbers (Mux=8).
- ? Pins and metal layers
- – 1P3M (1X_h_1Xb_v): 3 metal layers used and top metal is MXb.
- – Power mesh supported with M3 pins
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Single Port SRAM compiler - Memory optimized for ultra high density and high speed - compiler up to 64 k
- Foundry Sponsored Memory Instance
- Smart periphery design to reach the highest density
- Memory designed with SVT MOS for periphery and SVT HD PRBC from TSMC for memory core
- Flexible architecture
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Single Port SRAM compiler - Memory optimized for ultra high density and high speed - compiler range up to 64 k
- Smart periphery design to reach the highest density
- Memory designed with SVT MOS for periphery and SVT HD PRBC from TSMC for memory core
- Flexible architecture
- To offer several performance trade-offs for any memory size
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This fifo uses external onchip single port memory to store data.
- 1. Configurable Depth.
- 2. Configurable Width.
- 3. Configurable Clock freq.
- 4. Uses External OnChip Single Port Memory for Storage of Data