Hi-Speed USB IP

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Compare 26 IP from 4 vendors (1 - 10)
  • USB 2.0 Hi-Speed OTG Controller version 4 with Active Clock Gating to save active power
    • Configuration options to maximize performance and minimize CPU interrupts
    • Flexible parameters enable easy integration into low and high-latency systems
    • Transfer- or transaction-based processing of USB data based on system requirements
    • Configurable data buffering options to fine-tune performance/ area trade-offs
    Block Diagram -- USB 2.0 Hi-Speed OTG Controller version 4 with Active Clock Gating to save active power
  • USB 2.0 Hi-Speed OTG Controller Subsystem w/AHB Interface Supporting HSIC (config. as Device only or Full Speed only)
    • Configuration options to maximize performance and minimize CPU interrupts
    • Flexible parameters enable easy integration into low and high-latency systems
    • Transfer- or transaction-based processing of USB data based on system requirements
    • Configurable data buffering options to fine-tune performance/ area trade-offs
    Block Diagram -- USB 2.0 Hi-Speed OTG Controller Subsystem w/AHB Interface Supporting HSIC (config. as Device only or Full Speed only)
  • USB 2.0 OTG Dual Role Device (DRD) Controller
    • Compliant with OTG Supplement Rev. 1.0a
    • USB 2.0 Compliant
    • Supports 480 Mbit/s (HS), 12 Mbit/s (FS), and 1.5 Mbit/s (LS)
    • Supports Session Request Protocol (SRP) and Host Negotiation Protocol (HNP)
    Block Diagram -- USB 2.0 OTG Dual Role Device (DRD) Controller
  • USB 2.0 Device Controller version 4 with Active Clock Gating to save active power
    • Configuration options to maximize performance and minimize CPU interrupts
    • Flexible parameters enable easy integration into low and high-latency systems
    • Transfer- or transaction-based processing of USB data based on system requirements
    • Configurable data buffering options to fine-tune performance/ area trade-offs
    Block Diagram -- USB 2.0 Device Controller version 4 with Active Clock Gating to save active power
  • USB 2.0 femtoPHY - TSMC 40ULP25 x1, OTG, Type-C
    • Saves on average $0.03 per die with 50% smaller USB silicon area than competing solutions
    • Extends battery life with near 0W standby power consumption and 30% lower active power
    • Saves months of implementation and verification effort with simplified configuration options
    • Supports USB 2.0 Hi-Speed, Full Speed, and Low Speed
    Block Diagram -- USB 2.0 femtoPHY - TSMC 40ULP25 x1, OTG, Type-C
  • USB 2.0 picoPHY in GF (40nm, 28nm)
    • Complete mixed-signal physical layer for single-chip USB 2.0 OTG and non-OTG applications
    • Small PHY macro area
    • Low power
    • Advanced power management features, including support for power supply gating, supply scaling, ultra-low standby current support, and power management unit (PMU) interrupt support
  • USB 2.0 nanoPHY in GF (55nm)
    • Complete mixed-signal physical layer for single-chip USB 2.0 OTG and non-OTG applications
    • Low power: <100mW (during HS packet transmission)
    • Small area: ~ 0.6mm2
    • High yield—Architecture designed to improve key operating margins by having less sensitivity to variations due to foundry process, chip and board parasitics, and process device model variations
  • Super-Speed Plus USB 3.2 Hub Controller
    • Supports two lanes or one lane - easily configurable
    • Number of downstream ports can be easily selected
    • Complies with USB 3.2 standard for Super-Speed Plus(10Gbps),Super-Speed(5.0 Gbps), Hi-Speed (480 Mbps), Full-Speed (12 Mbps) and Low-Speed (1.5 Mbps).
    • Backward compatible with USB2.0 devices and hubs and the type A connectors.
    Block Diagram -- Super-Speed Plus USB 3.2 Hub Controller
  • USB 2.0 Digital Controller IP
    • Fully supports Hi-Speed (480 Mbps), Full Speed (12 Mbps), and Low Speed (1.5 Mbps) (USB 2.0 Speeds) specifications
    • Configurable root hub supports 1 to 15 downstream ports
    • 60MHz or 30MHz input clock, and 48MHz and 12MHz input clocks
    • ULPI and UTMI+ interfaces for rapid PHY integration
  • USB 2.0 picoPHY in UMC (40nm, 28nm)
    • Complete mixed-signal physical layer for single-chip USB 2.0 OTG and non-OTG applications
    • Small PHY macro area
    • Low power
    • Advanced power management features, including support for power supply gating, supply scaling, ultra-low standby current support, and power management unit (PMU) interrupt support
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