Bluetooth BLE IP
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57
IP
from 14 vendors
(1
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10)
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Bluetooth Low Energy (BLE) IP
- Process technology: GLOBALFOUNDRIES22FDX or SMIC55LL
- No other special mask layers or devices such as MIM, HRP, or ESD are required
- Compliant with the Bluetooth 5.4 Low Energy Single Mode RF Standard
- Supply voltage: 1.1V +/-10%
- Operating junction temperature: -40°C to 85°C
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Bluetooth Dual Mode (Classic & BLE ) v5.0 Protocol Software Stack and Profiles IP
- Bluetooth SIG Qualified, Production Proven IP
- Proven Interoperability
- Low MIPS and Memory Footprint for Stack & Profiles
- Platform and Operating Systems (OS) agnostic and is designed for Easy Portability
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Bluetooth Dual Mode (Classic & BLE ) v5.3 Protocol Software Stack and Profiles IP
- Bluetooth SIG Qualified, Production Proven IP
- Proven Interoperability
- Low MIPS and Memory Footprint for Stack & Profiles
- Platform and Operating Systems (OS) agnostic and is designed for Easy Portability
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VeriSilicon Bluetooth Low Energy (BLE) RF IP
- Single supply voltage: 1.5V to 3.6V
- Operating junction temperature: -40ºC to 85ºC
- RF output power: +8dBm
- Low power consumption: RX: <12mW; TX: <14mW@0dBm
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Bluetooth Low Energy (BLE) analog PHY
- Leading technology of SMIC 55nm LL_RF process.
- Operating junction temperature: -40°C to 85°.
- BLE interface.(rfio)
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Bluetooth Low Energy (BLE) RF IP
- Single supply voltage: 1.5V to 3.6V
- Operating junction temperature: -40ºC to 85ºC
- RF output power: upto +2dBm
- Low power consumption: RX: <12mW; TX: <15mW@0dBm
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Bluetooth 5.x Low Energy (BLE) RF Transceiver
- Patented and groundbreaking Orca Live Wireless RF™ digital radio technology
- Market leading power efficiency
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Bluetooth low energy v5.3 Software based Linklayer IP
- Most procedures for the protocols implemented in software
- Minimum set of standard functions in hardware
- Designed for portability across 32-bit processors
- Architecture of firmware for low code and data footprint
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Bluetooth low energy v5.4 Baseband Controller, Protocol Software Stack and Profiles IP
- Implements Link layer and physical layer of LE controller specification
- v5.1 Madrid Features: DF - AoA/AoD
- Firmware portable for 8/16/32-bit microcontrollers
- Support for multiple processor bus and flexible RF
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Bluetooth LE v5.3 / Zigbee 3 RF/PHY for Global Foundry 55nm (Silicon proven IP)
- Silicon area < 1.6 mm2
