Specialty PECL IO IP, BOAC (Bonding Over Active Circuit), UMC 0.18um G2 process
Overview
UMC 0.18um GII Logic process 3.3V LVPECL IO with POC (Pad On Circuit).
Technical Specifications
Foundry, Node
UMC 180nm G2
UMC
Pre-Silicon:
180nm
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