PAD - HHGrace 110nm ULL

Key Features

• Ultra-low size DUP-PAD total solution
• Standard I/O size is low to 72um*40um
• HBM ESD: ±2000V; MM: ±200V; CDM: ±500V; LU: 150mA

Benefits

• Ultra-low size DUP-PAD total solution

Deliverables

• Technical documents,GDS hard macro to foundry for IP merge

Technical Specifications